All Categories

History

  1. Metoree
  2. Semiconductor Manufacturing
  3. Flip Chip Bonders
  4. Die Bonder Epoxy Die Bonder Model 7200CR (HiSOL,Inc.)
Die Bonder Epoxy Die Bonder Model 7200CR-7200CR
Die Bonder Epoxy Die Bonder Model 7200CR-HiSOL,Inc.

Die Bonder Epoxy Die Bonder Model 7200CR
HiSOL,Inc.

HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

28.6hours

Relatively Fast Response

About This Product

■Summary

Model 7200CR is a tabletop manual die bonder. Equipped with a new X-Y-Z 3-axis manipulator (patented) as standard for outstanding operability, workers can perform intuitive precision work without stress. It has a dual-head mechanism with a tool head that is compatible with adhesive dispensing and stamping and a tool head that is compatible with chip pick and place. Adhesive materials include silver paste, epoxy materials, UV resin, etc. The parts that can be picked up include chip sizes from □0.1mm, wires from 0.015mm, and balls from 0.060mm, making it versatile enough to accommodate any application. Masu. Features

■X-Y-Z 3-axis manipulator

This is a patent of WEST BOND. The X, Y, and Z axes can be driven simultaneously with a single manipulator. This is a high-precision manipulator that is used not only in semiconductors but also in a wide range of fields such as biotechnology.

■Chip rotation mechanism

Chips etc. picked up by the suction collet can be freely rotated 360 degrees using the knob at hand. Since the rotation ratio of the hand knob and collet is almost the same, it is possible to achieve intuitive and accurate mounting.

■Adhesive dispensing

Adhesive material can be dispensed by air. Dispense time can be set from 0ms to 999ms.

■Adhesive stamping

Supports stamping of adhesive by using an adhesive applicator needle (stamp tool). Stamp size is Φ0.030mm~

■Squeegee mechanism

Work holder with squeegee mechanism (optional) can be attached to adjust the amount of adhesive applied during stamping.

■Spot welder

A spot welder can be installed as an option. Suitable for welding in minute areas.

■Special applications

It can be used for various purposes such as paste wiring, marking, wiring cutting, cleaving, gold block mounting, 3D mounting, etc.

  • Product

    Die Bonder Epoxy Die Bonder Model 7200CR

Share this product


80+ people viewing

Last viewed: 14 hours ago

Free
Get started with our free quotation service - no cost, no obligation.

No Phone Required
We respect your privacy. You can receive quotes without sharing your phone number.

1 Models of Die Bonder Epoxy Die Bonder Model 7200CR

Image Part Number Price (excluding tax) Load Operation Cleavage Wire size Ball size Bonding method Pickup detection Pickup method Bump cutting Dispense detection Dispense method Tip rotation mechanism Chip size Dai puff time Spot welding Stamping Marking/cutting wires Epoxy flow time
Die Bonder Epoxy Die Bonder Model 7200CR-Part Number-7200CR

7200CR

Available upon quote

10g~120g

X-Y-Z 3-axis manipulator (patented)

Available (optional)

Φ0.013mm~

Φ0.060mm~

Load crimping method

High hand switch/contact pressure

Vacuum adsorption method

Available (optional)

Height/hand switch/contact pressure

Air dispense method

360 degrees

□0.1mm~

0ms~25ms

Available (optional)

30μmΦ~

Available (optional)

0ms~999ms

Customers who viewed this product also viewed

Reviews shown here are reviews of companies.

Flip chip bonder YSB55w-Yamaha Robotics Holdings Co., Ltd.

Flip chip bonder YSB55w

Yamaha Robotics Holdings Co., Ltd.

110+ people viewing

Last viewed: 7 minutes ago

Response time: 39.31 hours

Flip Chip Bonders
Flip chip bonder for small devices AFM-15-PFA Co., Ltd.

Flip chip bonder for small devices AFM-15

PFA Co., Ltd.

350+ people viewing

Last viewed: 4 hours ago

Response time: 92.87 hours

Flip Chip Bonders

6 models listed

Ultra-high precision die bonder with advanced pickup function SPA-1000-Yamaha Robotics Holdings Co., Ltd.

Ultra-high precision die bonder with advanced pickup function SPA-1000

Yamaha Robotics Holdings Co., Ltd.

120+ people viewing

Last viewed: 8 minutes ago

Response time: 39.31 hours

Flip Chip Bonders

2 models listed

High-speed, high-precision small chip die bonder STC-800-Yamaha Robotics Holdings Co., Ltd.

High-speed, high-precision small chip die bonder STC-800

Yamaha Robotics Holdings Co., Ltd.

140+ people viewing

Last viewed: 3 minutes ago

Response time: 39.31 hours

Flip Chip Bonders

2 models listed

Manual flip chip placement system Model 850 with excellent ease of use and positioning accuracy-Hugle Electronics Co., Ltd.

Manual flip chip placement system Model 850 with excellent ease of use and positioning accuracy

Hugle Electronics Co., Ltd.

60+ people viewing

Last viewed: 10 minutes ago

Response time: 51.55 hours

Flip Chip Bonders

2 models listed

Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865-Hugle Electronics Co., Ltd.

Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865

Hugle Electronics Co., Ltd.

80+ people viewing

Last viewed: 17 hours ago

Response time: 51.55 hours

Flip Chip Bonders

2 models listed

Tabletop manual ball wire & bump bonder MODEL-7700D-HiSOL,Inc.

Tabletop manual ball wire & bump bonder MODEL-7700D

HiSOL,Inc.

240+ people viewing

Last viewed: 6 hours ago

Response time: 28.63 hours

Flip Chip Bonders

4 models listed

Ultra-high precision mounting machine flip chip bonder M1300-HiSOL,Inc.

Ultra-high precision mounting machine flip chip bonder M1300

HiSOL,Inc.

140+ people viewing

Last viewed: 4 hours ago

Response time: 28.63 hours

Flip Chip Bonders
Auto flip chip bonder MODEL-400-HiSOL,Inc.

Auto flip chip bonder MODEL-400

HiSOL,Inc.

190+ people viewing

Last viewed: 9 minutes ago

Response time: 28.63 hours

Flip Chip Bonders

2 models listed

Tabletop flip chip bonder M90 for research and development-HiSOL,Inc.

Tabletop flip chip bonder M90 for research and development

HiSOL,Inc.

200+ people viewing

Last viewed: 14 hours ago

Response time: 28.63 hours

Flip Chip Bonders

2 models listed

WSB2 Wafer bonding equipment WSB2 Wafer bonder 1WBS7 (6 inch type)-HiSOL,Inc.

WSB2 Wafer bonding equipment WSB2 Wafer bonder 1WBS7 (6 inch type)

HiSOL,Inc.

30+ people viewing

Last viewed: 15 hours ago

Response time: 28.63 hours

Flip Chip Bonders
Wafer bonding equipment WSB2 Wafer bonder 1WBS2 (4 inch type)-HiSOL,Inc.

Wafer bonding equipment WSB2 Wafer bonder 1WBS2 (4 inch type)

HiSOL,Inc.

50+ people viewing

Response time: 28.63 hours

Flip Chip Bonders
See More Flip Chip Bonders Products

Other products of HiSOL,Inc.

Reviews shown here are reviews of companies.

Probe card-HiSOL,Inc.

Probe card

HiSOL,Inc.

130+ people viewing

Last viewed: 2 hours ago

Response time: 28.63 hours

Probe Cards

2 models listed

Atmospheric pressure lamp annealing equipment RTP/RTA 8 inch compatible AccuThermo AW820M-HiSOL,Inc.

Atmospheric pressure lamp annealing equipment RTP/RTA 8 inch compatible AccuThermo AW820M

HiSOL,Inc.

90+ people viewing

Last viewed: 4 hours ago

Response time: 28.63 hours

Annealing Furnaces
IC socket burn-in test-HiSOL,Inc.

IC socket burn-in test

HiSOL,Inc.

100+ people viewing

Last viewed: 20 minutes ago

Response time: 28.63 hours

BGA Scokets

2 models listed

Capillary for ball bonding-HiSOL,Inc.

Capillary for ball bonding

HiSOL,Inc.

100+ people viewing

Last viewed: 16 minutes ago

Response time: 28.63 hours

Capillaries
Tabletop UV curing furnace lamp type UV PITARI-HiSOL,Inc.

Tabletop UV curing furnace lamp type UV PITARI

HiSOL,Inc.

100+ people viewing

Last viewed: 11 hours ago

Response time: 28.63 hours

Ultraviolet (UV) Dryers

2 models listed

Measuring Instruments/Measuring Systems Ellipsometer-HiSOL,Inc.

Measuring Instruments/Measuring Systems Ellipsometer

HiSOL,Inc.

90+ people viewing

Last viewed: 2 hours ago

Response time: 28.63 hours

Ellipsometers
Laser microprocessing equipment-HiSOL,Inc.

Laser microprocessing equipment

HiSOL,Inc.

90+ people viewing

Last viewed: 3 hours ago

Response time: 28.63 hours

Microfabrication Machines
Tabletop multi-wire bonder (ball & wedge type) MODEL-7KE-HiSOL,Inc.

Tabletop multi-wire bonder (ball & wedge type) MODEL-7KE

HiSOL,Inc.

180+ people viewing

Last viewed: 27 minutes ago

Response time: 28.63 hours

Semiconductor Manufacturing Equipment Component & Part Machining

3 models listed

Desktop manual wedge bonder E series-HiSOL,Inc.

Desktop manual wedge bonder E series

HiSOL,Inc.

150+ people viewing

Last viewed: 10 hours ago

Response time: 28.63 hours

Wire Bonders
Tabletop manual deep access wedge bonder MODEL-7476D (7600D specification)-HiSOL,Inc.

Tabletop manual deep access wedge bonder MODEL-7476D (7600D specification)

HiSOL,Inc.

180+ people viewing

Last viewed: 15 hours ago

Response time: 28.63 hours

Wire Bonders
Die Bonder Manual Epoxy Eutectic Die Bonder Model 7372E-HiSOL,Inc.

Die Bonder Manual Epoxy Eutectic Die Bonder Model 7372E

HiSOL,Inc.

120+ people viewing

Last viewed: 2 hours ago

Response time: 28.63 hours

Flip Chip Bonders

2 models listed

Tabletop flip chip bonder M90 for research and development-HiSOL,Inc.

Tabletop flip chip bonder M90 for research and development

HiSOL,Inc.

200+ people viewing

Last viewed: 14 hours ago

Response time: 28.63 hours

Flip Chip Bonders

2 models listed


View more products of HiSOL,Inc.

About Company Handling This Product

HiSOL,Inc.

Response Rate

100.0%

Response Time

28.6hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

See More

  • Japan

Related search keywords

Flip Chip Bonders
Flip Chip Bonders　HiSOL,Inc.
HiSOL,Inc.

This is the version of our website addressed to speakers of English in the United States. If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.

Copyright © 2025 Metoree