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  3. Flip Chip Bonders
  4. Flip chip bonder YSB55w (Yamaha Robotics Holdings Co., Ltd.)
Flip chip bonder YSB55w-YSB55w
Flip chip bonder YSB55w-Yamaha Robotics Holdings Co., Ltd.

Flip chip bonder YSB55w
Yamaha Robotics Holdings Co., Ltd.

About This Product

■Summary

・Achieved approximately 3 times the productivity and approximately 2 times the high precision mounting compared to conventional models. Bringing a “semiconductor assembly revolution” to the expanding flip chip market ・High speed 13,000 UPH with simultaneous suction and simultaneous transfer of 8 parts ・High accuracy ±5μm (3σ) ・High quality and versatility

■Features

・High-speed mounting is achieved through parallel processing using dual flip heads and simultaneous bonding process for 8 components. ・Highly rigid frame and control algorithm achieves excellent positioning accuracy ・Equipped with a high-performance bump recognition camera for position correction ・Small load control head ・Supports a wide range of chip sizes from □2 to □30mm ・Flux transfer unit that allows easy design changes

  • Product

    Flip chip bonder YSB55w

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1 Models of Flip chip bonder YSB55w

Image Part Number Price (excluding tax)
Flip chip bonder YSB55w-Part Number-YSB55w

YSB55w

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About Company Handling This Product

Yamaha Robotics Holdings Co., Ltd.

  • Japan

Related search keywords

Flip Chip Bonders
Flip Chip Bonders　Yamaha Robotics Holdings Co., Ltd.
Yamaha Robotics Holdings Co., Ltd.

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