Organic package FC-CSP/module
Kyocera Corporation
About This Product
■Proposing cutting-edge technology that makes full use of our technological development capabilities
In the smart device market, there is a growing need for products to be smaller, thinner, and lighter. On the other hand, the advent of 5G has enabled high-speed, low-latency, and large-capacity communications, which is accelerating demand for data centers.
At our company, we are actively promoting the development of board technology to flexibly respond to these market demands, providing a variety of products from small and thin boards to high-frequency compatible boards, and responding to customer feedback. .
■Features
・4-layer structure achieved by using ultra-thin base material: 0.17mm thickness
・Optimal manufacturing method (subtractive method, MSAP method, SAP method) to meet product requirements is possible
・Providing high-density substrates using small-diameter via formation and fine wiring technology
・Provide build-up materials suitable for product requirements, including high-frequency materials
・It is also possible to manufacture high multilayer boards, and it is compatible with flexible materials and structures.
・Compatible with green specifications such as lead-free solder and halogen-free
■Product usage
・Camera module
・Communication module
・DSP (Digital Signal Processor)
・ASIC for high-performance game consoles
・SSD controller
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Product
Organic package FC-CSP/module
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Handling Company
Kyocera Corporation
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Categories
1 Models of Organic package FC-CSP/module
| Product Image | Part Number | Price (excluding tax) | Core thickness | Layer composition | Line/Space (Core) | Line/Space (buildup) | Plate thickness |
|---|---|---|---|---|---|---|---|
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FC-CSP/Module |
Available upon quote | 0.03mm | 10 layers | 20/25μm | 12/15μm | 0.17mm |
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About Company Handling This Product
- Japan