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  2. Boards & Circuit Boards
  3. Printed Circuit Boards (PCB)
  4. Organic package FC-BGA (Kyocera Corporation)
Organic package FC-BGA-FC-BGA
Organic package FC-BGA-Kyocera Corporation

Organic package FC-BGA
Kyocera Corporation

Kyocera Corporation's Response Status

Response Rate

100.0%

Response Time

46.0hours

About This Product

■Build-up substrate adapted to industry-leading design rules

Kyocera's FC-BGA substrate is a highly reliable high-density organic package substrate for semiconductors that enables fine design rules. Using the industry's most advanced build-up board design and processing technology, we provide high-quality, high-performance organic packages with build-up structures that are compatible with high-end flip-chip LSIs with over 9,000 pins of I/O.

■Features

・Achieve Line/Space: 9μm/12μm with cutting-edge class fine wiring rules ・Achieving high-density wiring by forming small diameter vias using a laser ・Uses highly reliable thermosetting epoxy resin ・Surface treatment tailored to mounting needs is possible (Ni/Pd/Au, Solder pre-coat, etc.) ・Supports green specifications such as lead-free and halogen-free.

■Product usage

・High-end server MPU ・ASIC for network routers/switches ・Automotive SoC ・ASIC for high-performance game consoles ・FPGA ・Graphics processor, etc.

  • Product

    Organic package FC-BGA

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1 Models of Organic package FC-BGA

Image Part Number Price (excluding tax) Layer composition Flip chip pad pitch Buildup layer wiring width/gap Beer land diameter Core layer wiring width/gap
Organic package FC-BGA-Part Number-FC-BGA

FC-BGA

Available upon quote

Up to 10-n-10 μm

100 μm

2024/09/12 μm

85 μm

30/45 μm

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About Company Handling This Product

Kyocera Corporation

Response Rate

100.0%

Response Time

46.0hrs

  • Japan

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