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  2. Module material Metal matrix composite material Substrate Baseplate (Toyominato Co., Ltd.)
Module material Metal matrix composite material Substrate Baseplate-Substrate (AlSiC)
Module material Metal matrix composite material Substrate Baseplate-Toyominato Co., Ltd.

Module material Metal matrix composite material Substrate Baseplate
Toyominato Co., Ltd.

About This Product

Sales of Ai/SiC composite materials and metal matrix composite materials such as spacers, substrates, and housings whose main components are Cu-Mo. Due to its excellent thermodynamic and mechanical properties, AlSiC substrates are widely used in equipment equipped with high-power IGBT modules.

■Application field

Board-related products are applied to fields such as railways, smart grids, and power electronics.

■Product characteristics

High thermal conductivity Low expansion High rigidity Strong bond Good weldability

  • Product

    Module material Metal matrix composite material Substrate Baseplate

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1 Models of Module material Metal matrix composite material Substrate Baseplate

Image Part Number Price (excluding tax) Electrical conductivity (mS/m) Copper plating (μm) Gold plating (μm) Thermal expansion coefficient (×10^-6/K) Thermal conductivity (W/m·K) Density (g/cm3) Volume fraction (Vol%)
Module material Metal matrix composite material Substrate Baseplate-Part Number-Substrate (AlSiC)

Substrate (AlSiC)

Available upon quote

>6

8~12

＞1.3

6.5~9

200 ± 20

2.97~3.1

65~70

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Toyominato Co., Ltd.

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