Copper inlay substrates are useful for heat dissipation of heat-generating components. Heat dissipation is achieved by press-fitting a copper ingot (copper inlay) directly under the heat-generating parts. Since heat is not dissipated throughout the board, it has the same degree of wiring freedom as a normal multi-layer through-board. It is also possible to mount components on both sides of the board. (The copper inlay itself has no continuity reliability.)
■Characteristics of copper inlay board
・Multi-layered boards are possible, which is difficult with metal-based boards.
・It is possible to select the optimal copper inlay size according to the amount of heat generated.
■Main uses
・In-vehicle electric power steering (EPS)
・In-vehicle electronic control unit (ECU)
・Automotive LED headlamp
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