LTCC application device Interposer substrate for semiconductor inspection
Yokoo Co., Ltd.
About This Product
■New solutions developed with LTCC and RF technology. Yokowo's LTCC substrates and packages are expanding around the world.
Based on LTCC Low Temperature Co-fired Ceramics technology, we provide small, low-profile, RF-compatible LTCC boards that achieve high-density wiring.
■Interposer substrate for semiconductor inspection
LSI semiconductor wafers have up to several thousand bonding pads densely arranged, and in order to test their characteristics, a prober that spatially expands the semiconductor's narrow pitch pads and connects them to a tester is essential.
Yokoo has made full use of cutting-edge LTCC process technology to create the interposer substrate, which is the heart of the product. Together with Yokowo's fine precision processing vertical probe, it meets the latest demands in the semiconductor wafer inspection field.
-
Product
LTCC application device Interposer substrate for semiconductor inspection
-
Handling Company
Yokoo Co., Ltd.
-
Categories
2 Models of LTCC application device Interposer substrate for semiconductor inspection
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
|
|
12-inch interposer board for memory (built-in power supply/GND) |
Available upon quote |
|
|
Interposer board for logic (multi-pin/multi-Dut) |
Available upon quote |
Click on the part number for more information about each product
Customers who viewed this product also viewed
Other products of Yokoo Co., Ltd.
View more products of Yokoo Co., Ltd.
About Company Handling This Product
- Japan