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Fully automatic industrial AFM Park NX-3DM for high-resolution 3D metrology-NX-3DM
Fully automatic industrial AFM Park NX-3DM for high-resolution 3D metrology-Park Systems Japan Co., Ltd.

Fully automatic industrial AFM Park NX-3DM for high-resolution 3D metrology
Park Systems Japan Co., Ltd.

Park Systems Japan Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

26.4hours

Relatively Fast Response


About This Product

Park Systems introduces the innovative Park 3DM Series, a fully automated AFM system designed for overhang profiles, high-resolution sidewall imaging, and critical angle measurements. A patented separate XY and Z scanning system with a tilted Z scanner overcomes the challenges of regular and flared tip methods for accurate sidewall analysis. The Park 3DM series enables non-destructive measurements of soft photoresist surfaces with high aspect ratio tips.

■Fully automated industrial AFM with NX technology

Compatible with cleanrooms and fully automates measurements and data analysis at the nanoscale level ・NX technology automatically constructs highly accurate topography images and collects critical dimensional data The best low-noise Z detector on the market operates in an independent closed loop to minimize topography errors (“creep effects”) -True Non-Contact™ mode allows accurate, high-resolution data to be collected without damaging the tip or sample while reducing cost and time

■Innovative head design with undercut and overhang structure

- Unique lateral Z-head allows access to undercut and overhang structures in photoresists and other industrial materials - Patented separated XY and Z scanning system works in conjunction with a tilted Z scanner to overcome the challenges of regular and flared tip methods for accurate sidewall analysis ・NX-3DM can measure all sidewall trench line profiles, roughness, critical angles, and critical dimensions - Z-head tilting mechanism uses ultra-sharp tips to access sidewalls and obtain high resolution and precision comparable to other materials

■Reliable seamless measurement tool for 3D materials

- No sample preparation (cutting, mounting, coating, etc.) required to obtain measurements of sidewall roughness and critical dimensions ・Introduction of Z-head tilt and true non-contact™ mode enables collection of high-resolution sidewall data and maintains chip shape

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    Fully automatic industrial AFM Park NX-3DM for high-resolution 3D metrology

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1 Models of Fully automatic industrial AFM Park NX-3DM for high-resolution 3D metrology

Image Part Number Price (excluding tax) Electric angle range Electric focus stage Electric Z stage Electric XY stage Equipment conditions Acoustic noise Equipment conditions Power supply Equipment conditions Total power consumption Equipment conditions Humidity Equipment conditions Exhaust system Equipment conditions Floor vibration level Equipment conditions Room temperature (during operation) Equipment conditions Room temperature (standby) Equipment conditions Ground resistance Z scanner XY scanner resolution XY scanner COGNEX pattern recognition 300mm system ceiling height 300mm system work space 300mm system 200mm system ceiling height 200mm system work space 200mm system
Fully automatic industrial AFM Park NX-3DM for high-resolution 3D metrology-Part Number-NX-3DM

NX-3DM

Available upon quote

19 degrees and +19 degrees, -38 degrees and +38 degrees, angle repeatability: <0.5 degrees

Z travel distance: 9mm, direct optical system

Z travel distance: 27mm, resolution: 0.08㎛, repeatability: <1㎛

200mm: Moves up to 275mmx200mm, Resolution: 0.5㎛/300 mm: Moves up to 400mmx300mm, Resolution: 0.5㎛

65dB or less

208V-240V, single phase, 15A (max)

2KW (nominal)

30%~60% (without condensing)

Vacuum: -80kPa, CDA (or N2): 0.7MPa

VC-D (6μm/sec)

18℃~24℃

10℃~40℃

100 ohms or less

Z scanner range: 15 ㎛ (large mode), 2 ㎛ (small mode) /Z scanner resolution: 0.016 nm (large mode), 0.002 nm (small mode), etc.

0.28nm (large mode), 0.03nm (small mode)

Single module flexure XY scanner with closed-loop control, 100 µm x 100 µm (large mode), 50 µm x 50 µm (medium mode), 10 µm x 10 µm (small mode)

Pattern alignment resolution 1/4 pixel

2,500mm or more

4,540mm (width) x2,850mm (back), minimum

1,840mm (width) x 1,170mm (back) x 2,050mm (height), without EFEM, approximately 1,320 kg (with control cabinet), etc.

2,500mm or more

3,300mm (width) x2,300mm (back), minimum

1,500mm (width) x 980mm (back) x 2,050mm (height), without EFEM, approximately 1,020 kg (with control cabinet), etc.

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About Company Handling This Product

Response Rate

100.0%


Response Time

26.4hrs

  • Japan

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