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The only AFM for wafer fabs with automatic defect inspection function Park NX-Wafer-NX-Wafer
The only AFM for wafer fabs with automatic defect inspection function Park NX-Wafer-Park Systems Japan Co., Ltd.

The only AFM for wafer fabs with automatic defect inspection function Park NX-Wafer
Park Systems Japan Co., Ltd.

Park Systems Japan Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

26.4hours

Relatively Fast Response


About This Product

Park NX-Wafer is an industry-leading automated AFM measurement system for semiconductor and related fabrication. Enabling wafer fab inspection and analysis, automated defect inspection of bare wafers and substrates, and CMP profile measurements, Park NX-Wafer has the highest nanoscale surface resolution with sub-Angstrom height accuracy to prevent damage to the tip of the chip. You can overlap scans without giving Park NX-Wafer is equipped with automated system features such as automatic tip exchange, live monitoring, reference mark-less target positioning, and automatic analysis, making it the industry's best semiconductor AFM instrument.

■Features

・Low-noise atomic force microscope for more accurate CMP profile measurements ・Measures sub-angstrom surface roughness with high precision and minimizes chip-to-chip variation ・Fully automated AFM solution for defect imaging and analysis ・Fully automatic system equipped with automatic chip exchange and robotic wafer handler ・Supports scanning of 300mm wafers

  • Product

    The only AFM for wafer fabs with automatic defect inspection function Park NX-Wafer

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1 Models of The only AFM for wafer fabs with automatic defect inspection function Park NX-Wafer

Image Part Number Price (excluding tax) Acoustic noise Electric focus stage Electric Z stage Electric XY stage Sample thickness tolerance range Equipment conditions Acoustic noise Equipment conditions Power supply Equipment conditions Total power consumption Equipment conditions Humidity Equipment conditions Exhaust system Equipment conditions Floor vibration level Equipment conditions Room temperature (during operation) Equipment conditions Room temperature (standby) Equipment conditions Ground resistance Floor vibration noise All scan range Z clearance Z scanner detector noise Z scanner resolution Z scanner range XY scanner resolution XY scanner range DAC COGNEX pattern recognition C.E. ADC 300mm system layout 200mm system layout
The only AFM for wafer fabs with automatic defect inspection function Park NX-Wafer-Part Number-NX-Wafer

NX-Wafer

Available upon quote

>20dB reduction (using acoustic enclosure)

Z driving distance 9mm, direct optical system

Z driving distance 25mm, resolution 0.08μm, repeatability <1μm

200mm: Drive 275mm x 200mm, resolution 0.5μm/300mm: Drive 400mm x 300mm, resolution 0.5μm

Max 20mm

65dB or less

208V-240V, single phase, 15A (max)

2KW (nominal)

30%~60% (no condensation)

Vacuum: -80kPa, CDA (orN2): 0.7MPa

VC-D standard (6μm/sec)

18℃~24℃

10℃~40℃

100 ohms or less

<0.5μm/s (10Hz~200Hz, using active vibration isolation table)

<2nm, repeatability <1nm

0.03nm, rms (typical)

0.016nm (Large mode), 0.002nm (Small mode)

15µm (Large mode), 2µm (Small mode)

0.15nm (Large mode)

100μm×100μm (Large mode), 50μm×50μm (Medium mode), 10μm×10μm (Small mode)

17 channels, 2 high-speed DAC channels (64 MSPS), 20-bit DAC (X, Y and Z scanner position sensor)

Pattern alignment resolution 1/4 pixel

SEMI Standard S2/S8

18 channels, 4 high-speed ADC channels (64 MSPS), 24-bit ADC (X, Y and Z scanner position sensor)

3,486mm (width) x 1,450mm (depth) x 2,400mm (height), approximately 2,950kg (including control cabinet), ceiling height 2,500mm or less, etc.

2,732mm (width) x 1,100mm (depth) x 2,400mm (height), approximately 2,110kg (including control cabinet), ceiling height 2,500mm or less, etc.

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About Company Handling This Product

Response Rate

100.0%


Response Time

26.4hrs

  • Japan

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