The only AFM for wafer fabs with automatic defect inspection function Park NX-Wafer
Park Systems Japan Co., Ltd.
About This Product
Park NX-Wafer is an industry-leading automated AFM measurement system for semiconductor and related fabrication.
Enabling wafer fab inspection and analysis, automated defect inspection of bare wafers and substrates, and CMP profile measurements, Park NX-Wafer has the highest nanoscale surface resolution with sub-Angstrom height accuracy to prevent damage to the tip of the chip. You can overlap scans without giving
Park NX-Wafer is equipped with automated system features such as automatic tip exchange, live monitoring, reference mark-less target positioning, and automatic analysis, making it the industry's best semiconductor AFM instrument.
■Features
・Low-noise atomic force microscope for more accurate CMP profile measurements
・Measures sub-angstrom surface roughness with high precision and minimizes chip-to-chip variation
・Fully automated AFM solution for defect imaging and analysis
・Fully automatic system equipped with automatic chip exchange and robotic wafer handler
・Supports scanning of 300mm wafers
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Product
The only AFM for wafer fabs with automatic defect inspection function Park NX-Wafer
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Handling Company
Park Systems Japan Co., Ltd.
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Categories
1 Models of The only AFM for wafer fabs with automatic defect inspection function Park NX-Wafer
| Product Image | Part Number | Price (excluding tax) | 200mm system layout | 300mm system layout | ADC | Acoustic noise | All scan range Z clearance | C.E. | COGNEX pattern recognition | DAC | Electric XY stage | Electric Z stage | Electric focus stage | Equipment conditions Acoustic noise | Equipment conditions Exhaust system | Equipment conditions Floor vibration level | Equipment conditions Ground resistance | Equipment conditions Humidity | Equipment conditions Power supply | Equipment conditions Room temperature (during operation) | Equipment conditions Room temperature (standby) | Equipment conditions Total power consumption | Floor vibration noise | Sample thickness tolerance range | XY scanner range | XY scanner resolution | Z scanner detector noise | Z scanner range | Z scanner resolution |
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NX-Wafer |
Available upon quote | 2,732mm (width) x 1,100mm (depth) x 2,400mm (height), approximately 2,110kg (including control cabinet), ceiling height 2,500mm or less, etc. | 3,486mm (width) x 1,450mm (depth) x 2,400mm (height), approximately 2,950kg (including control cabinet), ceiling height 2,500mm or less, etc. | 18 channels, 4 high-speed ADC channels (64 MSPS), 24-bit ADC (X, Y and Z scanner position sensor) | >20dB reduction (using acoustic enclosure) | <2nm, repeatability <1nm | SEMI Standard S2/S8 | Pattern alignment resolution 1/4 pixel | 17 channels, 2 high-speed DAC channels (64 MSPS), 20-bit DAC (X, Y and Z scanner position sensor) |
200mm: Drive 275mm x 200mm, resolution 0.5μm/300mm: Drive 400mm x 300mm, resolution 0.5μm|
Z driving distance 25mm, resolution 0.08μm, repeatability <1μm
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Z driving distance 9mm, direct optical system
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65dB or less
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Vacuum: -80kPa, CDA (orN2): 0.7MPa
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VC-D standard (6μm/sec)
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100 ohms or less
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30%~60% (no condensation)
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208V-240V, single phase, 15A (max)
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18℃~24℃
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10℃~40℃
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2KW (nominal)
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<0.5μm/s (10Hz~200Hz, using active vibration isolation table)
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Max 20mm
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100μm×100μm (Large mode), 50μm×50μm (Medium mode), 10μm×10μm (Small mode)
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0.15nm (Large mode)
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0.03nm, rms (typical)
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15µm (Large mode), 2µm (Small mode)
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0.016nm (Large mode), 0.002nm (Small mode)
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