Automatic detection of notch and bevel defects X-ray topography equipment JV SENSUS
Bruker Corporation
About This Product
■X-ray topography equipment that automatically detects notch and bevel defects
Bruker JV Sensus is a fab X-ray topography system. With the recent increase in the number of processes that apply deep trench stress to silicon substrates, the need to measure invisible cracks that occur during the process has greatly increased. In particular, defects are likely to occur in non-uniform areas within the wafer such as notches and bevels, which can be analyzed using the zero edge exclusion measurement provided by this device.
Since it uses X-rays, it can penetrate even metal patterns and make measurements. High throughput of 24 WPH is achievable with the high speed option (600f).
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Product
Automatic detection of notch and bevel defects X-ray topography equipment JV SENSUS
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Handling Company
Bruker Corporation
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Categories
1 Models of Automatic detection of notch and bevel defects X-ray topography equipment JV SENSUS
| Product Image | Part Number | Price (excluding tax) |
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SENSUS CS |
Available upon quote |
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About Company Handling This Product
- United States of America