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  4. Build up board (Cygnus Co., Ltd.)

Build up board
Cygnus Co., Ltd.

About This Product

After forming the core layer (two-layer to multi-layer penetration), which is the core of the build-up configuration, insulating layers and conductor layers are sequentially laminated one by one from the core layer to the surface layer, and interlayer connections are made using a laser to create a multilayer print. It is a wiring board. By using laser vias (non-through vias) for interlayer connections, flexible wiring designs are possible, and their demand and applications have been expanding in recent years. In addition, since laser vias have a small diameter, they are also used on boards that are mounted with narrow pitch BGA (0.3mm pitch or less), etc., which cannot be handled by filling them with resin. Our company handles multi-stage builds (we have a track record of up to 4 stages), stacked vias, and filled via plating through integrated in-house manufacturing.

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    Build up board

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1 Models of Build up board

Image Part Number Price (excluding tax) Basic specification example

Build up board

Available upon quote

10-layer 3-4-3 build-up board with 0.4mm pitch BGA (Filled via/Stacked via specification)

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About Company Handling This Product

Cygnus Co., Ltd.

  • Japan

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Printed Circuit Boards (PCB)
Printed Circuit Boards (PCB)　Cygnus Co., Ltd.
Cygnus Co., Ltd.

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