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Next-generation box PC MB1-10AP equipped with Intel® Apollo Lake processor-MB1-10AP
Next-generation box PC MB1-10AP equipped with Intel® Apollo Lake processor-Fuji Soft Co., Ltd.

Next-generation box PC MB1-10AP equipped with Intel® Apollo Lake processor
Fuji Soft Co., Ltd.

🚗 Automotive & Transport Use

Fuji Soft Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

16.0hours

Relatively Fast Response


About This Product

■ Overview / features

MITAC Computing Technology MB1-10AP EMBEDDED BOX PC is a next-generation box PC equipped with Intel® Apollo Lake processors. The completely new SOC structure incorporates more powerful functions for tasks and applications. The MB1-10AP's 1.5-liter fan-reshall design and the expandable module design can flexibly adapt to any workspace and environment. With the support of the DIN rail mount, it can be used in the factory environment and application. The support of the VESA mount allows spaces and rear mounts on the flat screen display. Various peripherals with abundant I/O ports (Ethernet RJ45 X 3, USB3.0 X 4, HDMI X 1, RS232/422/485 X 2, 3pin terminal stand power input x 1, expansion socket x 1). Connection is possible. Storage expandability supports a 2.5 -inch HDD bracket design high -density hard drive. Two MPCIE (one is shared with MSATA) slots support SSDs and wireless interfaces that enable simple connections to Wi-Fi and Bluetooth networks and 4G connections. The HDMI and one additional extension display module extends visual experiences with dual display support.

■ Specifications

1. Front I/O 1 X HDMI 1.4/4 X USB 3.0/2 X SMA antenna (WiFi/LTE function options)/1 XPANSION Modular Door/2 X RS232/422/485 (Support Power Supply 5V/12V) 2. back I/O 3 X RJ-45/1 x Mike input/1 X-line output/1 x 3 Pinter Minal block power input/2 X SMA antenna (option to WiFi/LTE function) * There are other specifications.

  • Product

    Next-generation box PC MB1-10AP equipped with Intel® Apollo Lake processor
  • Usage Scenarios

    Automotive & Transport Use

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1 Models of Next-generation box PC MB1-10AP equipped with Intel® Apollo Lake processor

Image Part Number Price (excluding tax) Thermal design attachment Dimensions (W × D × H) weight material CPU Chipset System memory Graphics Display interface Storage slot Ethernet audio I/O chipset Tpm Internal speaker indicator Watch dog timer Extended slot wireless Expansion slot storage Input Power Power adapter Operating temperature Operation humidity Vibration resistance Impact resistance certification OS support
Next-generation box PC MB1-10AP equipped with Intel® Apollo Lake processor-Part Number-MB1-10AP

MB1-10AP

Available upon quote

Fanless

Wall mount/100 mm x 100 mm VESA mount & Din rail mount combo kit (optional)

170 x 105 x 57 mm

1.3kg (2.8 pounds)

Top cover: Aluminum alloy, bezel and chassis: steel

Intel® Apollo Lake-M N4200/N3350 processor

Intel®SOC integration

DDR3L 1866 MHz /1 x 204 Pin SO-DIMM /Up to 8GB (non-ECC)

Intel®HD graphics

HDMI 1.4/Optional DisplayPort/VGA/DVI-D by EXPANSION Module

1 x 2.5 HDD /SSD (default with HDD bracket) /1 x MSATA

2 X intel®I210-IT GIGA LAN (2 X PoE LAN: option) /1 X Realtek RTL8154 LAN (up to 480Mbps)

REALTEK®ALC662

Nuvoton NCT6116D

NUVOTON NPCT750AAYX TPM2.0 (optional)

1 x buzzer

Power button/power supply LED/HDD LED

1-255 steps for each software program

M.2 2230 E key (PCIE, USB)

MPCIE full size (USB/PCIE/SATA)

8 to 24V Wide Range DC input, Terminal block connection

optional

-25 ~ 70 ° C (for SKU other than PoE) /-25 ~ 60 ° C (for PoE SKU) /air flow 0.7m /sec and wide temperature memory /storage

10 ~ 90 % R/H (no condensation)

At the time of operation: 5 ~ 500Hz/5GRMS/3AXIS (with SSD, IEC60068-2-64 compliant)

At the time of operation: 50 GRMS, semi-string wave 11 ms duration (with SSD, compliance with IEC60068-27)

CE/FCC class A

Windows 10 64 -bit/Linux (Request Support)

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About Company Handling This Product

Response Rate

100.0%


Response Time

16.0hrs


Company Review

5.0
  • Japan

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