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  4. Electronic materials for FA mounting [Semiconductor related] Insulating adhesive (Panasonic Industry Co., Ltd.)

Electronic materials for FA mounting [Semiconductor related] Insulating adhesive
Panasonic Industry Co., Ltd.

About This Product

Providing short-curing pastes that can improve productivity and save energy

■Common features of the DBN series

・No sag or stringiness ・Low temperature (100℃~150℃), short time (1 minute~20 minutes) curing ・Easy to work with one-component type ・Does not use solvents that cause bleed-out

  • Product

    Electronic materials for FA mounting [Semiconductor related] Insulating adhesive

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1 Models of Electronic materials for FA mounting [Semiconductor related] Insulating adhesive

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Insulating adhesive

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Panasonic Industry Co., Ltd.

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