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  4. FA Electronic materials for mounting [For mounting] BGA/CSP reinforcement methods and materials (Panasonic Industry Co., Ltd.)

FA Electronic materials for mounting [For mounting] BGA/CSP reinforcement methods and materials
Panasonic Industry Co., Ltd.

About This Product

■We will propose the most suitable reinforcement method according to the application.

・Corner bond: Efficiently relieves stress applied to solder bumps at corners. Shorter process time and easier repair work ・Underfill: Low temperature curing with less damage to parts

  • Product

    FA Electronic materials for mounting [For mounting] BGA/CSP reinforcement methods and materials

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1 Models of FA Electronic materials for mounting [For mounting] BGA/CSP reinforcement methods and materials

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BGA/CSP reinforcement method/material

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Panasonic Industry Co., Ltd.

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