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  3. Flip Chip Bonders
  4. FA semiconductor related system flip chip bonder MD-P200US2 (Panasonic Industry Co., Ltd.)
FA semiconductor related system flip chip bonder MD-P200US2-MD-P200US2
FA semiconductor related system flip chip bonder MD-P200US2-Panasonic Industry Co., Ltd.

FA semiconductor related system flip chip bonder MD-P200US2
Panasonic Industry Co., Ltd.

About This Product

MD-P200US2 is a bonder exclusively for ultrasonic flip chip mounting developed for cutting-edge small device products.

■Features

・The basic structure is fixed point pickup and fixed point mounting that supports up to Φ200 mm wafer supply. ・We perform mounting using our unique stable and highly rigid US heating head to achieve high quality metal bonding. ・Process management such as traceability is possible with real-time US monitoring function. - Quality control functions such as post-bond inspection, bump inspection, and nozzle inspection are also available.

■Applications

Assembly of small high value-added devices such as SAW devices, TCXOs, LEDs, MEMS, power devices, etc.

  • Product

    FA semiconductor related system flip chip bonder MD-P200US2

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1 Models of FA semiconductor related system flip chip bonder MD-P200US2

Image Part Number Price (excluding tax)
FA semiconductor related system flip chip bonder MD-P200US2-Part Number-MD-P200US2

MD-P200US2

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Panasonic Industry Co., Ltd.

Related search keywords

Flip Chip Bonders
Flip Chip Bonders　Panasonic Industry Co., Ltd.
Panasonic Industry Co., Ltd.

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