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  3. Flip Chip Bonders
  4. FA semiconductor related system flip chip bonder MD-P300 (Panasonic Industry Co., Ltd.)
FA semiconductor related system flip chip bonder MD-P300-MD-P300
FA semiconductor related system flip chip bonder MD-P300-Panasonic Industry Co., Ltd.

FA semiconductor related system flip chip bonder MD-P300
Panasonic Industry Co., Ltd.

About This Product

MD-P300 is a flip chip bonder that mounts bare ICs for cutting-edge device products at high speed and with high quality.

■Features

・The basic structure is fixed point pickup and fixed point mounting that supports the supply of up to Φ300 mm wafers. ・Processes can be changed by changing tools. (Compatible with GGI/C4/TCB) - By feeding forward the recognition results of the backside of the chip using the flip camera to the handling using the mounting nozzle, high precision mounting of ±5 um is achieved. ・High-speed implementation with productivity of 5,500 CPH (number of production per hour) is achieved.

■Applications

Assembly of CMOS image sensors, various processors, MEMS, power devices, etc.

  • Product

    FA semiconductor related system flip chip bonder MD-P300

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1 Models of FA semiconductor related system flip chip bonder MD-P300

Image Part Number Price (excluding tax)
FA semiconductor related system flip chip bonder MD-P300-Part Number-MD-P300

MD-P300

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Panasonic Industry Co., Ltd.

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Flip Chip Bonders
Flip Chip Bonders　Panasonic Industry Co., Ltd.
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