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  3. Flip Chip Bonders
  4. FA semiconductor related system die bonder MD-P200 (Panasonic Industry Co., Ltd.)
FA semiconductor related system die bonder MD-P200-MD-P200
FA semiconductor related system die bonder MD-P200-Panasonic Industry Co., Ltd.

FA semiconductor related system die bonder MD-P200
Panasonic Industry Co., Ltd.

About This Product

MD-P200 is a device bonder that mounts bare ICs of cutting-edge device products at high speed and with high quality.

■Features

The basic structure is fixed-point pickup and fixed-point mounting that supports up to Φ200 mm wafer supply. In response to manufacturing innovations such as multiplication, miniaturization/thinness, and layering, various functions such as flip chip mounting, heated ultrasonic mounting, DAF mounting, stack mounting, etc. can be selected.

■Applications

Assembly of high value-added devices such as RF modules, MEMS, power devices, sensors, etc.

  • Product

    FA semiconductor related system die bonder MD-P200

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1 Models of FA semiconductor related system die bonder MD-P200

Image Part Number Price (excluding tax)
FA semiconductor related system die bonder MD-P200-Part Number-MD-P200

MD-P200

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Panasonic Industry Co., Ltd.

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