PINK's new sintering technology / reliable heat -resistant sintering joining
PINK has developed a new sintering system using silver paste, especially as a request from the current electronic device field, especially to improve durability, reliability, and heat resistance. Silver paste sintering is an excellent technology replacing the conventional (soldering) technology of high -performance electronic devices.
By using a PINK sinning system, we can sintered bonding that realizes reliability, durability, and heat -resistant bonding. Laring the target product surface can use various materials for the product, making the process easier.
◆ Compact type Sining system SIN 20 Development Prototype Use to small quantity production applications
The new sintering device Sin 20 was developed to support R & D and research institutions in the setup, evaluation, and optimization of sintered processes.
Sin 20 uses a patented equilibrium vacuum technology based on PINK's experience based on the technical principle of pressure uniformity. As a result, it can be sintered not only in the N2 atmosphere but also in a reduction atmosphere such as gin acid. Not only the CU board, but also the au or AG finish board can be sintered.
◆ Flexible top tool system (high press pressure soft tool or hard tool)
Target application:
・ Die -touch to the board and the lead frame
・ Installing the board to the base plate
・ Dateop interconnecting
・ High power LED joining
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