Vacuum voice free sordering connection equipment and systems
Vacuum reflow system for high quality processing
The latest electronic components, such as power supply modules, hybrids and multi -chip integrated circuits, have continuously improved output density. Therefore, it is necessary to have high quality sordering that can always meet the needs of growing. The voice (= air bubbles) of the sording connection must be avoided.
The best way to solve this problem is vacuum sordering.
PINK's vacuum reflow system enables voice -free sordering such as a large power supply module in a series of pre -form and (or) paste in a series of processes.
・ Intelligent temperature control functions enhance cycle time and improvement of output.
・ Environmental protection and user -friendly clever structure
・ Flexible soleding technology that meets customer needs
・ Perfect and reproducible solaring result by permanent process control
◆ Compact structure and high reliability
The compact and powerful reflow system VADU 100 is equipped with a souldering zone and a cooling zone, so it can be used not only in solder paste but also in pre -form.
Because it is compact and easy to operate, it is suitable for small continuous production and research in laboratory.
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