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  4. Ultrasonic soldering device (large) Ultrasonic component terminal dipping device ACSS-Scudding-2900 (Komura Tech Co., Ltd.)
Ultrasonic soldering device (large) Ultrasonic component terminal dipping device ACSS-Scudding-2900-ACSS-Scudding-2900
Ultrasonic soldering device (large) Ultrasonic component terminal dipping device ACSS-Scudding-2900-Komura Tech Co., Ltd.

Ultrasonic soldering device (large) Ultrasonic component terminal dipping device ACSS-Scudding-2900
Komura Tech Co., Ltd.

About This Product

By inserting a component into an ultrasonic dip bath and applying ultrasonic waves from the side, it is possible to solder the component. By adding roll-to-roll and handlers, it becomes possible to support automation.

■Product features

This is a device for bonding electrodes to glass substrates for solar cells, dimming glass, organic EL, etc. It is common knowledge that glass cannot be soldered, but it is possible to solder to glass using our special solder and ultrasonic soldering technology. By joining rectangular copper wire coated with special solder to the soldered area, it becomes electrode wiring for extracting charge from solar cells and electrode wiring for applying voltage to dimming glass, etc. Typical features

■Jet mechanism

By lifting the solder from the bottom of the solder tank, pure solder is supplied at a stable liquid level.

■Nitrogen purge

Increases the surface tension of solder, allowing dipping of pitch pitch parts without solder bridging.

■Wide horn

By applying ultrasonic waves with a wide width, parts feeding speed can be increased.

■Roll to roll

Continuous parts supply

■This product solves these problems.

Using flux causes problems such as staining, deterioration of parts, and rust in equipment. Additionally, for narrow pitch parts, the wetting effect of flux may cause solder bridging of the terminals. Ultrasonic dipping enables component dipping without flux. Introducing other usage scenarios

■Aluminum wire tin plating

Solid aluminum wire is tin-plated continuously using an ultrasonic vibrator using a roll-to-roll method.

■Kyo pitch pattern solder coating

Using ultrasound and nitrogen purge, it enables solder coating without bridging into narrow pitch patterns such as QFP, BGA, and antenna wiring.

  • Product

    Ultrasonic soldering device (large) Ultrasonic component terminal dipping device ACSS-Scudding-2900

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1 Models of Ultrasonic soldering device (large) Ultrasonic component terminal dipping device ACSS-Scudding-2900

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Ultrasonic soldering device (large) Ultrasonic component terminal dipping device ACSS-Scudding-2900-Part Number-ACSS-Scudding-2900

ACSS-Scudding-2900

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