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  4. Ultrasonic soldering equipment (large size) Target material ultrasonic automatic bonding equipment USK-Bonding-1200 (Komura Tech Co., Ltd.)
Ultrasonic soldering equipment (large size) Target material ultrasonic automatic bonding equipment USK-Bonding-1200-USK-Bonding-1200
Ultrasonic soldering equipment (large size) Target material ultrasonic automatic bonding equipment USK-Bonding-1200-Komura Tech Co., Ltd.

Ultrasonic soldering equipment (large size) Target material ultrasonic automatic bonding equipment USK-Bonding-1200
Komura Tech Co., Ltd.

About This Product

Can be bonded to most backing plates and sputtering targets using ultrasonic soldering. We will develop an automatic machine that can handle not only planar targets, but also circular and cylindrical targets.

■Product features

The industry standard is to use ultrasonic soldering to attach sputter targets. Our origins began more than 20 years ago when we developed and proposed a process for applying indium to base materials using ultrasonic soldering in response to requests from target material manufacturers. At the time, the proposal was to use a manual hand trowel, but as the need for sputter targets for smartphones and TVs has increased, expectations for automated equipment have increased. Typical features

■Planer target application

Ultrasonic soldering to flat base materials

■Circular target application

Ultrasonic soldering while rotating the disc-shaped base material

■Cylindrical target application

Insert the ultrasonic soldering iron inside the cylinder (rotary)

■Automated line

Automatically handles everything from preheating the base material/back plate to ultrasonic soldering and joining.

■This product solves these problems.

By automating the work that was previously done manually by workers, it becomes possible to produce 24 hours a day, stabilize quality, and respond to increased production volume. Introducing other usage scenarios

■Planar target

Move the trowel freely in the XY plane to coat the entire surface.

■Cylindrical target (rotary target)

Insert the iron inside the cylinder and coat the inside of the cylinder target. Compatible materials

■This product can be soldered to the following materials.

・Titanium (Ti) ・Copper (Cu) ・Silver (Ag) ・Gold (Au) ・Platinum (Pt) ・Indium (In) ・Nickel (Ni) ・Chromium (Cr) ・Cobalt (Co) ・Tantalum (Ta) ・Molybdenum (Mo) ・Cu-Al alloy ・Mn alloy ・Ni alloy ・Co alloy ・Cr alloy ·zirconium ·hafnium ・Mullite ·rhodium ·palladium ・ITO alumina (Al2O3) ・CaO ・MgO ・SiO2 ・TiO2 ・ZnO ・ZrO2 ・CeO2 ・Si3N3

  • Product

    Ultrasonic soldering equipment (large size) Target material ultrasonic automatic bonding equipment USK-Bonding-1200

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1 Models of Ultrasonic soldering equipment (large size) Target material ultrasonic automatic bonding equipment USK-Bonding-1200

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Ultrasonic soldering equipment (large size) Target material ultrasonic automatic bonding equipment USK-Bonding-1200-Part Number-USK-Bonding-1200

USK-Bonding-1200

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