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  2. Diamond whetstone dicing blade (Nanotem Co., Ltd.)
Diamond whetstone dicing blade-Dicing blade
Diamond whetstone dicing blade-Nanotem Co., Ltd.

Diamond whetstone dicing blade
Nanotem Co., Ltd.

About This Product

■Enables high-speed cutting of difficult-to-cut materials such as sapphire, quartz glass, and silicon.

・Porous structure with 40% porosity ・Blades can be designed to accommodate groove shapes, etc. ・Completely custom-made dicing/blade - Demonstrates power in high-speed cutting of difficult-to-cut materials such as sapphire, quartz glass, silicon, and ceramics.

■Requirements for high-performance cutting blades

・Excellent sharpness ・Do not meander ・No chipping or chipping ・Less sharpness loss - Must be conductive (zero point adjustment)

■Characteristics [Focus on processing efficiency and cutting quality]

1.Applications/Available range (applicable parts, etc.) Blades can be designed to accommodate groove shapes, etc. 2. Differences/advantages with other companies in the same industry ・Ceramic bond type diamond blade ・Porous (40% porosity) structure maintains sharpness ・Can process difficult-to-cut materials such as sapphire, quartz glass, and silicon

  • Product

    Diamond whetstone dicing blade

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1 Models of Diamond whetstone dicing blade

Image Part Number Price (excluding tax)
Diamond whetstone dicing blade-Part Number-Dicing blade

Dicing blade

Available upon quote

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About Company Handling This Product

Nanotem Co., Ltd.

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