Diamond whetstone dicing blade-Dicing blade

Diamond whetstone dicing blade
Nanotem Co., Ltd.

About This Product

■Enables high-speed cutting of difficult-to-cut materials such as sapphire, quartz glass, and silicon.・Porous structure with 40% porosity
・Blades can be designed to accommodate groove shapes, etc.
・Completely custom-made dicing/blade
- Demonstrates power in high-speed cutting of difficult-to-cut materials such as sapphire, quartz glass, silicon, and ceramics.

■Requirements for high-performance cutting blades・Excellent sharpness
・Do not meander
・No chipping or chipping
・Less sharpness loss
- Must be conductive (zero point adjustment)

■Characteristics [Focus on processing efficiency and cutting quality]1.Applications/Available range (applicable parts, etc.) Blades can be designed to accommodate groove shapes, etc.
2. Differences/advantages with other companies in the same industry
・Ceramic bond type diamond blade
・Porous (40% porosity) structure maintains sharpness
・Can process difficult-to-cut materials such as sapphire, quartz glass, and silicon

Model
There are 1 models for this product.

Product
Diamond whetstone dicing blade

Handling Company
Nanotem Co., Ltd.

30+ people viewing

Last viewed: 5 hours ago

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1 Models of Diamond whetstone dicing blade

Image	Part Number	Price (excluding tax)
	Dicing blade	Available upon quote

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About Company Handling This Product

Nanotem Co., Ltd.

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Diamond whetstone dicing blade Nanotem Co., Ltd.

About This Product

■Enables high-speed cutting of difficult-to-cut materials such as sapphire, quartz glass, and silicon.

■Requirements for high-performance cutting blades

■Characteristics [Focus on processing efficiency and cutting quality]

1 Models of Diamond whetstone dicing blade

Dicing blade

Other products of Nanotem Co., Ltd.

About Company Handling This Product

Diamond whetstone dicing blade
Nanotem Co., Ltd.