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  3. Rigid print wiring board POH (Pad on Hole) / IVH substrate design, manufacturing, and implementation (Shinwa Print Industry Co., Ltd.)
Rigid print wiring board POH (Pad on Hole) / IVH substrate design, manufacturing, and implementation-POH (Pad on Hole) / IVH substrate
Rigid print wiring board POH (Pad on Hole) / IVH substrate design, manufacturing, and implementation-Shinwa Print Industry Co., Ltd.

Rigid print wiring board POH (Pad on Hole) / IVH substrate design, manufacturing, and implementation
Shinwa Print Industry Co., Ltd.

About This Product

Ligid substrate design-manufacturing-Compatible with domestic factories in domestic factories. Leave it to the Nonwa Print Industry if it is related to rigid substrates, such as small amounts, short delivery, short delivery, prototypes, mass production, etc.

■ Features

・ It is a print board with a VIA hole filled and a pad on it. ・ Because the installation area of ​​VIA can be reduced, high -density implementation can be realized. ・ Compatible with small lots/multiple types. We also accept prototypes and mass production from one repeat. ・ The processing of manufacturing small lots is highly efficient, reducing costs. ・ We achieve high reliability with more than 20 years of manufacturing know -how. ・ Since the work is performed on the implementation line in the company factory, short delivery time is possible. ・ It also supports the implementation of 0603 chips. ・ It is also possible to use our stock parts. ・ We will answer various requests. Please contact us for details.

■ Manufacturing process

・ Professional of implementation technology provides the best pattern design for requirement specifications. Please leave both flexible design and rigid board design. ・ Verify all design data before manufacturing. Prevents troubles caused by design data and realizes reliable products. ・ Speed ​​production on the production line in our own factory. We produce all of the flexes (FPC), rigid boards, and rigid flexible in -house.

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    Rigid print wiring board POH (Pad on Hole) / IVH substrate design, manufacturing, and implementation

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1 Models of Rigid print wiring board POH (Pad on Hole) / IVH substrate design, manufacturing, and implementation

Image Part Number Price (excluding tax) Number of layers Base material conductor surface treatment Environmental support
Rigid print wiring board POH (Pad on Hole) / IVH substrate design, manufacturing, and implementation-Part Number-POH (Pad on Hole) / IVH substrate

POH (Pad on Hole) / IVH substrate

Available upon quote

4-14 layers

Glass epoxy

Minimum LINE/Space: 100 μm/100 μm, minimum VIA: φ0.2TH/φ0.4land

Gold plating processing, heat -resistant pre -flux processing, soulder coat processing

ROHS command, lead -free, halogen -free support

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Shinwa Print Industry Co., Ltd.

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