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  3. Ligid printing wiring plate Design, manufacturing, and implementation of multilayer through hole board (4-14 layers) (Shinwa Print Industry Co., Ltd.)
Ligid printing wiring plate Design, manufacturing, and implementation of multilayer through hole board (4-14 layers)-Multi -layer penetration through hole board (4-14 layers)
Ligid printing wiring plate Design, manufacturing, and implementation of multilayer through hole board (4-14 layers)-Shinwa Print Industry Co., Ltd.

Ligid printing wiring plate Design, manufacturing, and implementation of multilayer through hole board (4-14 layers)
Shinwa Print Industry Co., Ltd.

About This Product

Ligid substrate design-manufacturing-Compatible with domestic factories in domestic factories. Leave it to the Nonwa Print Industry if it is related to rigid substrates, such as small amounts, short delivery, short delivery, prototypes, mass production, etc.

■ Features

・ It is a multi -layered print board with a conductor layer of 4 layers or more. ・ Compatible with small lots/multiple types. We also accept prototypes and mass production from one repeat. ・ The processing of manufacturing small lots is highly efficient, reducing costs. ・ We achieve high reliability with more than 20 years of manufacturing know -how. ・ Since the work is performed on the implementation line in the company factory, short delivery time is possible. ・ It also supports the implementation of 0603 chips. ・ It is also possible to use our stock parts. ・ We will answer various requests. Please contact us for details.

■ Manufacturing process

・ Professional of implementation technology provides the best pattern design for requirement specifications. Please leave both flexible design and rigid board design. ・ Verify all design data before manufacturing. Prevents troubles caused by design data and realizes reliable products. ・ Speed ​​production on the production line in our own factory. We produce all of the flexes (FPC), rigid boards, and rigid flexible in -house.

  • Product

    Ligid printing wiring plate Design, manufacturing, and implementation of multilayer through hole board (4-14 layers)

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1 Models of Ligid printing wiring plate Design, manufacturing, and implementation of multilayer through hole board (4-14 layers)

Image Part Number Price (excluding tax) Number of layers Base material conductor surface treatment Environmental support Safety standard
Ligid printing wiring plate Design, manufacturing, and implementation of multilayer through hole board (4-14 layers)-Part Number-Multi -layer penetration through hole board (4-14 layers)

Multi -layer penetration through hole board (4-14 layers)

Available upon quote

4-14 layers

Glass epoxy

Minimum LINE/Space: 100 μm/100 μm, minimum VIA: φ0.2TH/φ0.5land

Gold plating processing, heat -resistant pre -flux processing, soulder coat processing

ROHS command, lead -free, halogen -free support

UL supportable

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Shinwa Print Industry Co., Ltd.

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