Direct exposure equipment DE (Direct Exposure) for semiconductor post-processing
Adtech Engineering Co., Ltd.
About This Product
■Product overview
From applying FO-WLP-Wafer to applying PLP-panel size. It enables direct drawing on high-definition package substrates and high-definition, high-multilayer substrates. Direct writing exposure equipment for cutting-edge semiconductor FO packages, organic package substrates (advanced BGA), etc.
■Features
DE-2 W300, a direct-write exposure system for WLP, for manufacturing cutting-edge semiconductor FO packages, organic package substrates (advanced BGA), etc.; DE-2 P600, a direct-write exposure system for PLP
By using a high-precision stage to achieve an overlay of ±1 μm and a state-of-the-art optical system to achieve L/S: 2/2 μm, the high precision and high resolution required in the production of cutting-edge semiconductor FO packages and organic package substrates. We realized this.
Integration with Deca Technologies' Adaptive PatterningTM makes it possible to support multi-chip FO.
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Product
Direct exposure equipment DE (Direct Exposure) for semiconductor post-processing
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Handling Company
Adtech Engineering Co., Ltd.
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Categories
1 Models of Direct exposure equipment DE (Direct Exposure) for semiconductor post-processing
| Product Image | Part Number | Price (excluding tax) | Light source wavelength | Maximum Size | Minimum line width L/S | Overlay |
|---|---|---|---|---|---|---|
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DE-2 W300 |
Available upon quote | 405nm (h line) | Φ300mm | 2/2μm | ±1μm |
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