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  4. Direct exposure equipment DE (Direct Exposure) for semiconductor post-processing (Adtech Engineering Co., Ltd.)
Direct exposure equipment DE (Direct Exposure) for semiconductor post-processing-DE-2 W300
Direct exposure equipment DE (Direct Exposure) for semiconductor post-processing-Adtech Engineering Co., Ltd.

Direct exposure equipment DE (Direct Exposure) for semiconductor post-processing
Adtech Engineering Co., Ltd.

About This Product

■Product overview

From applying FO-WLP-Wafer to applying PLP-panel size. It enables direct drawing on high-definition package substrates and high-definition, high-multilayer substrates. Direct writing exposure equipment for cutting-edge semiconductor FO packages, organic package substrates (advanced BGA), etc.

■Features

DE-2 W300, a direct-write exposure system for WLP, for manufacturing cutting-edge semiconductor FO packages, organic package substrates (advanced BGA), etc.; DE-2 P600, a direct-write exposure system for PLP By using a high-precision stage to achieve an overlay of ±1 μm and a state-of-the-art optical system to achieve L/S: 2/2 μm, the high precision and high resolution required in the production of cutting-edge semiconductor FO packages and organic package substrates. We realized this. Integration with Deca Technologies' Adaptive PatterningTM makes it possible to support multi-chip FO.

  • Product

    Direct exposure equipment DE (Direct Exposure) for semiconductor post-processing

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1 Models of Direct exposure equipment DE (Direct Exposure) for semiconductor post-processing

Image Part Number Price (excluding tax) Minimum line width L/S Maximum Size Light source wavelength Overlay
Direct exposure equipment DE (Direct Exposure) for semiconductor post-processing-Part Number-DE-2 W300

DE-2 W300

Available upon quote

2/2μm

Φ300mm

405nm (h line)

±1μm

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Adtech Engineering Co., Ltd.

  • Japan

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