2-axis vertical grinder HVG-300DSO
Japan Engis Co., Ltd.
About This Product
The 2-axis vertical grinder HVG-300DSO uses a sliding work spindle designed to improve the quality of grinding. With one grinding device, grinding can be performed on the same basis without removing the workpiece from the workpiece chuck during the grinding wheel exchange, rough grinding and fine grinding processes, making it possible to perform highly accurate dimensional control and reduce machining allowance. .
■Advanced control options
- HVG-AD and HVG-ADM models are optionally equipped with automatic wheel dressing, automatic positioning of the cup wheel relative to the workpiece, and control of workpiece thickness measurement.
- Upgrade to in-process thickness measurement with real-time feedback to the grinding cycle for maximum control.
ADM models offer options for automated thickness measurement, including multipoint contact probing for multiple wafer grinding, or the choice of contact or non-contact continuous in-process measurement of a single wafer.
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Product
2-axis vertical grinder HVG-300DSO
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Handling Company
Japan Engis Co., Ltd.
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Categories
1 Models of 2-axis vertical grinder HVG-300DSO
| Product Image | Part Number | Price (excluding tax) | Body dimensions (WxDxHmm) | Grinding wheel outer diameter (mm) x Number of axes | Grinding wheel rotation speed (rpm) | Grinding wheel spindle motor (kW) | Weight (Kg NET) | Work axis conveyance method | Work table diameter (mm) | Work table rotation speed (rpm) |
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HVG-300DSO |
Available upon quote | 1,400x1,870x2,400 | ⌀305x2 | 2,000 | 7 | 4,300 | Sliding type | 350 | 400 |
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About Company Handling This Product
- Japan