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  4. Polishing pad (Japan Engis Co., Ltd.)
Polishing pad-R10
Polishing pad-Japan Engis Co., Ltd.

Polishing pad
Japan Engis Co., Ltd.

About This Product

The production of tight surface finishes on silicon or other semiconductor crystals is becoming increasingly demanding, making meeting the requirements of today's semiconductor industry critical. Engis offers a variety of polishing pad types according to customer requirements. For the features and specifications of each pad, please select the most suitable pad from the table below according to the various materials and polishing conditions. There is adhesive on the back side of the pad, so it is extremely easy to attach it to a polishing surface plate.

  • Product

    Polishing pad

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1 Models of Polishing pad

Image Part Number Price (excluding tax) Appropriate diamond particle size (µm) 6 Appropriate diamond particle size (µm) 3 Appropriate diamond particle size (µm) 1 Woven fabric Remarks
Polishing pad-Part Number-R10

R10

Available upon quote

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[Size] ⌀150, ⌀200, ⌀300, ⌀380, ⌀610, ⌀710, ⌀910, and other large sizes, please contact us.
Code No.9450/437 corresponds to oil-based.

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About Company Handling This Product

Japan Engis Co., Ltd.

  • Japan

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