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  4. CMP slurry (Japan Engis Co., Ltd.)
CMP slurry-HCL-20
CMP slurry-Japan Engis Co., Ltd.

CMP slurry
Japan Engis Co., Ltd.

About This Product

CMP (abbreviation for Chemical Mechanical Polishing) slurry is used to chemically etch the workpiece surface and mechanically remove and polish it. We offer a variety of CMP slurries that match the properties of the materials.

  • Product

    CMP slurry

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1 Models of CMP slurry

Image Part Number Price (excluding tax) Silica particle size (20nm)
CMP slurry-Part Number-HCL-20

HCL-20

Available upon quote

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About Company Handling This Product

Japan Engis Co., Ltd.

  • Japan

Related search keywords

Diamond Slurries
Diamond Slurries　Japan Engis Co., Ltd.
Japan Engis Co., Ltd.

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