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  4. High speed/high pressure wrapping equipment EJW-380HSP (Japan Engis Co., Ltd.)
High speed/high pressure wrapping equipment EJW-380HSP-EJW-380HSP
High speed/high pressure wrapping equipment EJW-380HSP-Japan Engis Co., Ltd.

High speed/high pressure wrapping equipment EJW-380HSP
Japan Engis Co., Ltd.

About This Product

EJW-380HSP series is a polishing device compatible with high-speed & high-pressure polishing machines. This machine is designed to polish substrate-shaped polycrystalline sintered diamond (PCD) and CVD diamond with high precision and efficiency. The temperature control system developed especially for PCD polishing responds to the increase in the temperature of the grinding wheel and controls the spindle speed and pressure to maintain the optimum processing temperature. In addition, many of the next-generation materials are hard, brittle, and difficult-to-cut materials, and are designed to withstand harsh processing conditions using high pressure and high rotational speeds to achieve highly efficient polishing.

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    High speed/high pressure wrapping equipment EJW-380HSP

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1 Models of High speed/high pressure wrapping equipment EJW-380HSP

Image Part Number Price (excluding tax) Power supply Weight (Kg NET) Device dimensions (WxDxHmm) Grinding wheel size (⌀Outer diameter mm) Water cooling mechanism Operation panel Rocking motor Forced drive motor Compatible wafer size Surface plate rotation speed (rpm) Processing recipe registration Control method Main motor (kW) Program
High speed/high pressure wrapping equipment EJW-380HSP-Part Number-EJW-380HSP

EJW-380HSP

Available upon quote

3 phase AC200V 50/60Hz

1,200

1,000x1,100x2,110

380

Turn base/work chuck section

LCD touch panel color

90W interlocking variable stroke

130W independent type
Maximum rotation speed 60rpm (CW/CCW)

Maximum 4inch

30~1,300

10 recipes

PLC control

5.5

Multi-step program 5 steps

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About Company Handling This Product

Japan Engis Co., Ltd.

  • Japan

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Grinders
Grinders　Japan Engis Co., Ltd.
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