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Double-sided wrapping device-EJD-6BY
Double-sided wrapping device-Japan Engis Co., Ltd.

Double-sided wrapping device
Japan Engis Co., Ltd.


About This Product

The EJD series is a double-sided polishing machine that is widely compatible with general abrasive grains, diamond abrasive grains, and fixed grindstone lapping and CMP processing. The standard full cover can also be used in semiconductor manufacturing environments. It also has a wide range of optional functions, such as real-time thickness detection, actual pressure control, and low-pressure, low-speed lowering control of the upper lapping surface plate, which are essential for simultaneous polishing of both sides of thin wafers.

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    Double-sided wrapping device

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1 Models of Double-sided wrapping device

Image Part Number Price (excluding tax) Drive method Power supply Weight (Kg NET) Standard surface plate size (⌀Outer diameter mm) Body dimensions (W x D x H mm) Spindle motor (kW) Lower surface plate rotation speed (rpm) Carrier (number of teeth/⌀outer diameter mm)
Double-sided wrapping device-Part Number-EJD-6BY

EJD-6BY

Available upon quote

4way

3 phase AC200V 50/60Hz

800

386

800x800x1,900

2.2

10~60

DP12/143.7

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