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Large wrapping device-EJW-610INF-3ALD
Large wrapping device-Japan Engis Co., Ltd.

Large wrapping device
Japan Engis Co., Ltd.


About This Product

We have a complete lineup of high-precision large lapping machines of various sizes to meet the high-precision lapping processing required by the mass production of high-value-added parts and larger diameter semiconductor wafers. In addition to the standard facing mechanism, the GNC series, which controls the Z-axis with a servo motor, allows for highly accurate flattening of the lapping plate and re-machining of spiral grooves by correcting the straightness of the facing slider.

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    Large wrapping device

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1 Models of Large wrapping device

Image Part Number Price (excluding tax) Power supply Weight (Kg NET) Pasting board size (mm) Water cooling mechanism Standard number of axes Standard surface plate size (⌀Outer diameter x ⌀Inner diameter mm) Body dimensions (W x D x H mm) Spindle motor (kW) Ring size (⌀Outer diameter x ⌀Inner diameter mm) Addition of facing mechanism
Large wrapping device-Part Number-EJW-610INF-3ALD

EJW-610INF-3ALD

Available upon quote

3 phase AC200V 50/60Hz

1,300

248

3 stations

610×210

1,200x1,300x1,900

3.7

286×250

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