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NIC BOND 2-component insulation heat dissipation adhesive NB4400-NB4400
NIC BOND 2-component insulation heat dissipation adhesive NB4400-Daizo Co., Ltd.

NIC BOND 2-component insulation heat dissipation adhesive NB4400
Daizo Co., Ltd.

Daizo Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

24.0hours

Relatively Fast Response


About This Product

■Product overview

NB4400 is a two-component insulating heat dissipating adhesive. It is characterized by fast curing and low outgas.

■Product features and applications

・Stress relaxation type ・Low temperature curing possible (80℃/3 hours) ・Short-time curing possible (150℃/5 minutes) ・Low outgas (0.09% at 200℃, 0.13% at 250℃) ・Proven track record with flexible circuit boards ・Hybrid board ・Ferrule adhesion

■Properties before curing

・Liquid: 2 liquid ・Mixing ratio (weight ratio): 100:3 ・Curing conditions: 150℃/1 hour ・Viscosity (after mixing): 40,000-65,000cP ・Pot life (23℃): 2 hours ・Storage conditions: room temperature ・Quality guarantee period: 1 year

■Properties after curing

・Tensile shear strength: 136kgf/cm2 ・Glass transition temperature (Tg): 90℃ or higher ・Linear expansion coefficient: 18ppm below Tg, 94ppm above Tg ・Shore D hardness: 85 ・Volume resistivity: 2×10^13Ω・cm or more ・Thermal conductivity: 1.2W/mK

  • Product

    NIC BOND 2-component insulation heat dissipation adhesive NB4400

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1 Models of NIC BOND 2-component insulation heat dissipation adhesive NB4400

Image Part Number Price (excluding tax) Shelf stability period Product packaging
NIC BOND 2-component insulation heat dissipation adhesive NB4400-Part Number-NB4400

NB4400

Available upon quote

Room temperature/12 months

500cc bottle set

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About Company Handling This Product

Response Rate

100.0%


Response Time

24.0hrs

  • Japan

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