Airtightness inspection equipment for small electronic components Bombing/Gross/Fine leak test system MSX-6110 series MSX-6110
FUKUDA CO., LTD.
About This Product
■What is the airtight inspection device for small electronic components?
This equipment performs leak tests on small electronic components that require airtightness, such as crystal devices, ceramic resonators, optical devices, power semiconductors, CAN devices, laser diodes, MEMS devices, SAW filters, small relays, and capacitors.
Leak testing of sealed products requires two types of inspection: gross leak test and fine leak test. We have a lineup of fully automatic machines that can perform the entire process on one machine, special machines (custom-made), and tabletop types that are convenient for sampling inspections.
■Bombing/Gross/Fine Leak Test System
This equipment performs leak tests while controlling conditions for helium immersion (bombing), gross leak, and fine leak tests.
This is a leak test system for small electronic components that require airtightness, such as crystal devices, ceramic resonators, optical devices, power semiconductors, CAN devices, laser diodes, MEMS-related products, SAW filters, small relays, and capacitors. We have a lineup of fully automatic machines, dedicated machines, and tabletop types.
■Leak inspection of electronic components, optical devices, etc. Gross leak, fine leak test system
There are two types of leak testing for sealed products: gross leak testing and fine leak testing. The gross leak test uses a differential pressure air leak test, and the fine leak test uses a helium leak test (bombing method).
■Leak detection range and compatible models
The lineup includes the following three models depending on the leak detection range, covering the entire leak rate range from large leaks to 10-15Pa m3/s (He). The Bombing Gross Fine Leak Test System is designed primarily for small workpieces of 2.5 x 2.0 or smaller, and has a function to manage the leaving time after filling with helium gas.
■ Gross leak measurement principle
For gross leak testing of small electronic components, a workpiece such as an SMD is placed in a small capsule and pressurized, and the minute pressure drop that occurs as the pressure inside the capsule leaks into the workpiece is measured. In addition, large leaks that leak instantly into the workpiece are measured by releasing the air inside the capsule into a small tank at atmospheric pressure and measuring the resulting pressure difference.
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Product
Airtightness inspection equipment for small electronic components Bombing/Gross/Fine leak test system MSX-6110 series MSX-6110
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Handling Company
FUKUDA CO., LTD.
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Categories
1 Models of Airtightness inspection equipment for small electronic components Bombing/Gross/Fine leak test system MSX-6110 series MSX-6110
| Product Image | Part Number | Price (excluding tax) | External dimensions (mm) *Excluding signal tower | Inspection target size (mm) | Minimum detectable leakage amount | Option | Pneumatic source | Power supply voltage/power consumption | Processing capacity | Processing speed | Transportation |
|---|---|---|---|---|---|---|---|---|---|---|---|
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MSX-6110 |
Available upon quote | W1,800×D1,150×H1,800 | 1.2×1.0~2.0×1.6 |
Gross leak: 2×10^-7Pa・m3/s (equivalent standard leak) Fine leak: 1×10^-9Pa・m3/s (He) |
We recommend installing a HEPA filter. |
Air pressure source: 0.5MPa or higher Please use clean, dry air that does not fluctuate. Recommended conditions: Compressed air cleanliness class 1, 3, 1 according to JISB8392-1:2012 |
AC200V±10% three-phase 50/60Hz4kVA | 8ch1.2s/pcs (Bombing 60min), 1.0s/pcs (Bombing 40min) | 8ch 1.2s/pcs (Bombing 60min) 1.0s/pcs (Bombing 40min) | OK/NGBOX removal (special specifications allow pallet loading/unloading, stacking, etc.) |
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About Company Handling This Product
- Japan