CAM joining-Heterogeneous material bonding technology
CAM joining-Teru Sound Corporation

CAM joining
Teru Sound Corporation


About This Product

CAM joining is an environmentally friendly, ultra -simple construction and cost reduction technology. The basic material combination that can be joined is "metal -thermoplastic resin", but by devising the processing method. ・ Metal -metal ・ Metal -thermal curing resin Combination is also possible. Metal species support aluminum, steel, metal plating, copper, and magnesium.

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    CAM joining




*Please note that we may not be able to accommodate sample requests.

1 Models of CAM joining

Product Image Part Number Price (excluding tax) TN-Q14-0.15-RS4.47T TN-Q14-0.15-RS4.47T/C53
CAM joining-Part Number-Heterogeneous material bonding technology

Heterogeneous material bonding technology

Available upon quote HF reading/writing head

Square type, height 14mm
Inspection surface: upper surface
Resin, PBT-GF30-VO
Power supply and operation can only be made when connecting to Blident interface
Connect only by M12 × 1 connector, Blident extension cable
HF reading/writing head
For bass line pology using tben-*

Square type, height 14mm
Inspection surface: upper surface
Resin, PBT-GF30-VO
No terminal resistance (separate end resistance is required)
This device can be operated only by connecting to tben-s*-2rfid-*or tben-l*-4rfid-*.
Up to 32 node/line or connection
Supported terminal resistance is required (see accessories)
In particular, please follow the performance of the power supply equipment and the maximum current capacity of the cable when turning the power.
Please make sure that the voltage drop on the line is within the regulations
Sparrine: Up to 2m
Maximum bus length: 50m
By default, the commands can only be processed by one read/write head, so HF bus mode is suitable for static applications and low -speed dynamic applications.
In the continuous HF bus mode, the command is executed simultaneously with all reading/writing heads in the bust pology. The recorded data is saved in the ring buffer of the module
The address is auto

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