This product is registered by Optoscience Co., Ltd..
About This Product
Digital 3D Image Correlation (DIC) is a 2D/3D strain measurement technique that measures deformation, vibration, and strain in various objects. The system is used to evaluate 3D properties in tensile, torsional, bending or combined tests. Additionally, deformation and strain analysis can be applied to fatigue testing, fracture mechanics, FEA validation, etc.
■Applications
The Q400 enables a wide range of applications, from microscopic investigation of microelectronics and biomedical materials to large-scale measurements of aerospace, automotive, marine, and railway components.
・Advanced materials (CFRP, wood, metal foam, rubber, etc.)
・Component testing (shape, displacement, strain, etc.)
・Material testing (Young's modulus, Poisson's ratio, elastic-plastic behavior)
・Fracture mechanics FEA verification
・High-speed applications (dynamic measurements, transient events)
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