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  4. Substrate with bump (Noshimitsu Photo Service Co., Ltd.)
Substrate with bump-Substrate with bump
Substrate with bump-Noshimitsu Photo Service Co., Ltd.

Substrate with bump
Noshimitsu Photo Service Co., Ltd.

Noshimitsu Photo Service Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

7.3hours

Fast Response

About This Product

Unlike a metal -based board with a general structure, it is possible to partially form a convex (bump) of the base metal, expose the convex portion formed on the surface layer, and direct the heat dissipation of the heat generated parts directly to remove heat to the metal base board.

■ Characteristics

･ Long life of high power LED ･ Shortening of heat dissipation routes

■ Use

･ High power LED module ･ Effective utilization of heat dissipation pads (neutral poles)

  • Product

    Substrate with bump

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1 Models of Substrate with bump

Image Part Number Price (excluding tax)
Substrate with bump-Part Number-Substrate with bump

Substrate with bump

Available upon quote

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About Company Handling This Product

Noshimitsu Photo Service Co., Ltd.

Response Rate

100.0%

Response Time

7.3hrs

  • Japan

Related search keywords

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