Substrate with bump
Noshimitsu Photo Service Co., Ltd.

About This Product

Unlike a metal -based board with a general structure, it is possible to partially form a convex (bump) of the base metal, expose the convex portion formed on the surface layer, and direct the heat dissipation of the heat generated parts directly to remove heat to the metal base board.

■ Characteristics･ Long life of high power LED
･ Shortening of heat dissipation routes

■ Use･ High power LED module
･ Effective utilization of heat dissipation pads (neutral poles)

Model
There is 1 model available for this product.

Product
Substrate with bump

Handling Company
Noshimitsu Photo Service Co., Ltd.

Categories

Boards & Circuit Boards

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1 Models of Substrate with bump

Image	Part Number	Price (excluding tax)
	Substrate with bump	Available upon quote

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About Company Handling This Product

Noshimitsu Photo Service Co., Ltd.

Japan

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Substrate with bump Noshimitsu Photo Service Co., Ltd.

About This Product

■ Characteristics

■ Use

1 Models of Substrate with bump