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  4. Tabletop device that automatically picks up chips after dicing and packs them into trays Supports a maximum wafer size of 8 inches Die sorter CT-200 (Hugle Electronics Co., Ltd.)
Tabletop device that automatically picks up chips after dicing and packs them into trays Supports a maximum wafer size of 8 inches Die sorter CT-200-CT-200
Tabletop device that automatically picks up chips after dicing and packs them into trays Supports a maximum wafer size of 8 inches Die sorter CT-200-Hugle Electronics Co., Ltd.

Tabletop device that automatically picks up chips after dicing and packs them into trays Supports a maximum wafer size of 8 inches Die sorter CT-200
Hugle Electronics Co., Ltd.

Hugle Electronics Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

51.6hours

About This Product

This is a tabletop device that automatically picks up chips after dicing and packs them into trays. Compatible with a maximum wafer size of 8in, reliable made in Japan with excellent cost performance.

■Product overview

A semi-automatic machine with a simple configuration that flexibly supports small-lot, high-mix production. Product types can be easily replaced with a removable jig. The compact, space-saving design allows for flexible replacement with existing equipment. ・High speed, high precision, and high reliability - Accurately transfer even small chips with automatic image recognition correction ・Reliable tape peeling with synchronous push-up mechanism ・Non-contact mechanism on the back of the chip ・Easy and reliable operability ・Windows10-based front access ・Touch panel operation

■Main options

・Tray packing based on mapping data ・Rank classification based on wafer test results ・Chip reversal mechanism ・NG mark recognition (standard) ・Communication function (operation by reading 2D code, etc.) ・Appearance inspection (simple inspection only: please contact us)

  • Product

    Tabletop device that automatically picks up chips after dicing and packs them into trays Supports a maximum wafer size of 8 inches Die sorter CT-200

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1 Models of Tabletop device that automatically picks up chips after dicing and packs them into trays Supports a maximum wafer size of 8 inches Die sorter CT-200

Image Part Number Price (excluding tax) Weight Equipment dimensions Automatic wafer θ correction Thrust-up part Image recognition Compatible wafer size Storage side stage Control Supply side stage Chip size Takt time Expand
Tabletop device that automatically picks up chips after dicing and packs them into trays Supports a maximum wafer size of 8 inches Die sorter CT-200-Part Number-CT-200

CT-200

Available upon quote

Approximately 200kg

700 (W) x800 (D) x1,300 (H) mm

±5°

Synchronous type (2-stage thrust)

Pattern matching
(position, angle, NG mark, corner, etc.)

6"/8

2"□ (15 pieces)
3"□ (8 pieces)
4"□ (6 pieces)
JEDEC (1 piece)
Soft tray, customer-specific design possible

PC (Windows10)

Dicing frame (for ~8 inches)
Grip ring (for ~8 inches)

0.5mm~20.0mm *Actual results: Minimum 0.25mm (conditions apply) □・Maximum 32mm□, etc. Please contact us for details.

0.7sec/chip (reference data)

MAX15mm

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About Company Handling This Product

Hugle Electronics Co., Ltd.

Response Rate

100.0%

Response Time

51.6hrs

  • Japan

Related search keywords

Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　Hugle Electronics Co., Ltd.
Hugle Electronics Co., Ltd.

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