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  4. Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays. (Hugle Electronics Co., Ltd.)
Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays.-CT-300
Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays.-Hugle Electronics Co., Ltd.

Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays.
Hugle Electronics Co., Ltd.

Hugle Electronics Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

51.6hours

About This Product

This is a tabletop device that automatically picks up chips after dicing and packs them into trays. Compatible with a maximum wafer size of 12in, reliable made in Japan with excellent cost performance. There is also an option for fully automatic support on both the supply and storage sides.

■Product overview

A semi-automatic machine with a simple configuration that flexibly supports small-lot, high-mix production. Product types can be easily replaced with a removable jig. The compact, space-saving design allows for flexible replacement with existing equipment. ・High speed, high precision, and high reliability - Accurately transfer even small chips with automatic image recognition correction ・Reliable tape peeling with synchronous push-up mechanism ・Non-contact mechanism on the back of the chip ・Easy and reliable operability ・Windows10-based front access ・Touch panel operation

■Main options

・Tray packing based on mapping data ・Rank classification based on wafer test results ・Chip reversal mechanism ・NG mark recognition (standard) ・Communication function (operation by reading 2D code, etc.) ・Appearance inspection (simple inspection only: please contact us)

  • Product

    Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays.

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1 Models of Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays.

Image Part Number Price (excluding tax) Weight Equipment dimensions Automatic wafer θ correction Thrust-up part Image recognition Compatible wafer size Storage side stage Control Supply side stage Chip size Takt time Expand
Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays.-Part Number-CT-300

CT-300

Available upon quote

Approximately 250kg

890 (W) x850 (D) x1,300 (H) mm

±5°

Synchronous type (2-stage thrust)

Pattern matching
(position, angle, NG mark, corner, etc.)

6"/8"/12

2"□ (15 pieces)
3"□ (8 pieces)
4"□ (6 pieces)
JEDEC (1 piece)
Soft tray, customer-specific design possible

PC (Windows10)

Dicing frame (for ~12 inches)
Grip ring (for ~12 inches)

0.5mm~20.0mm *Actual results: Minimum 0.25mm (conditions apply) □・Maximum 32mm□, etc. Please contact us for details.

0.7sec/chip (reference data)

MAX15mm

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About Company Handling This Product

Hugle Electronics Co., Ltd.

Response Rate

100.0%

Response Time

51.6hrs

  • Japan

Related search keywords

Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　Hugle Electronics Co., Ltd.
Hugle Electronics Co., Ltd.

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