Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays.
Hugle Electronics Co., Ltd.
About This Product
This is a tabletop device that automatically picks up chips after dicing and packs them into trays. Compatible with a maximum wafer size of 12in, reliable made in Japan with excellent cost performance. There is also an option for fully automatic support on both the supply and storage sides.
■Product overview
A semi-automatic machine with a simple configuration that flexibly supports small-lot, high-mix production. Product types can be easily replaced with a removable jig. The compact, space-saving design allows for flexible replacement with existing equipment.
・High speed, high precision, and high reliability
- Accurately transfer even small chips with automatic image recognition correction
・Reliable tape peeling with synchronous push-up mechanism
・Non-contact mechanism on the back of the chip
・Easy and reliable operability
・Windows10-based front access ・Touch panel operation
■Main options
・Tray packing based on mapping data
・Rank classification based on wafer test results
・Chip reversal mechanism
・NG mark recognition (standard)
・Communication function (operation by reading 2D code, etc.)
・Appearance inspection (simple inspection only: please contact us)
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Product
Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays.
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Handling Company
Hugle Electronics Co., Ltd.
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Categories
1 Models of Die sorter CT-300 is a tabletop device that automatically picks up chips after dicing and packs them into trays.
| Product Image | Part Number | Price (excluding tax) | Automatic wafer θ correction | Chip size | Compatible wafer size | Control | Equipment dimensions | Expand | Image recognition | Storage side stage | Supply side stage | Takt time | Thrust-up part | Weight |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CT-300 |
Available upon quote | ±5° | 0.5mm~20.0mm *Actual results: Minimum 0.25mm (conditions apply) □・Maximum 32mm□, etc. Please contact us for details. | 6"/8"/12 | PC (Windows10) | 890 (W) x850 (D) x1,300 (H) mm | MAX15mm |
Pattern matching (position, angle, NG mark, corner, etc.) |
2"□ (15 pieces) 3"□ (8 pieces) 4"□ (6 pieces) JEDEC (1 piece) Soft tray, customer-specific design possible |
Dicing frame (for ~12 inches) Grip ring (for ~12 inches) |
0.7sec/chip (reference data) | Synchronous type (2-stage thrust) | Approximately 250kg |
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