Peel the diced chips from the dicing tape without damaging the backside Chip/Tape Separator Model 4800
Hugle Electronics Co., Ltd.
About This Product
Our unique method allows chips to be peeled off from the dicing tape without damaging the back side.
■Product overview
・Model 4800 chip/tape separator is a device that uses a unique method to separate chips from tape after wafer dicing.
・Unlike the conventional needle push-up method, there is no damage to the back side of the chip.
- After peeling, it can be used for a wide range of purposes, such as sorting good and bad chips with vacuum tweezers, and packing them into trays.
-Model 4800 consists of a temperature controller, grit surface plate, vacuum plate, and hot plate.
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Product
Peel the diced chips from the dicing tape without damaging the backside Chip/Tape Separator Model 4800
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Handling Company
Hugle Electronics Co., Ltd.
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Categories
1 Models of Peel the diced chips from the dicing tape without damaging the backside Chip/Tape Separator Model 4800
| Product Image | Part Number | Price (excluding tax) | Power supply | Size | Vacuum | Weight |
|---|---|---|---|---|---|---|
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Model 4800 |
Available upon quote | 100-120V2Amp50/60Hz | 135 (D) × 255 (W) × 215 (H) mm | 85kPa | 3.5kg |
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