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  4. Grip ring used to maintain the expanded state of the wafer (Hugle Electronics Co., Ltd.)
Grip ring used to maintain the expanded state of the wafer-GRP-2620-33
Grip ring used to maintain the expanded state of the wafer-Hugle Electronics Co., Ltd.

Grip ring used to maintain the expanded state of the wafer
Hugle Electronics Co., Ltd.

Hugle Electronics Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

51.6hours

About This Product

A grip ring used to hold the wafer in its expanded state.

■Product overview

・Easy to remove - Lighter, thinner and space-saving compared to conventional aluminum rings. ・Available in various sizes up to 12 inches

  • Product

    Grip ring used to maintain the expanded state of the wafer

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1 Models of Grip ring used to maintain the expanded state of the wafer

Image Part Number Price (excluding tax) Inner ring inner diameter/outer diameter (unit: mm) Outer ring inner diameter/outer diameter (unit: mm)
Grip ring used to maintain the expanded state of the wafer-Part Number-GRP-2620-33

GRP-2620-33

Available upon quote

121/127

115/121

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About Company Handling This Product

Hugle Electronics Co., Ltd.

Response Rate

100.0%

Response Time

51.6hrs

  • Japan

Related search keywords

Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　Hugle Electronics Co., Ltd.
Hugle Electronics Co., Ltd.

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