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  4. Grip ring used to maintain the expanded state of the wafer (Hugle Electronics Co., Ltd.)
Grip ring used to maintain the expanded state of the wafer-GRP-2620-33
Grip ring used to maintain the expanded state of the wafer-Hugle Electronics Co., Ltd.

Grip ring used to maintain the expanded state of the wafer
Hugle Electronics Co., Ltd.

About This Product

A grip ring used to hold the wafer in its expanded state. ■Product overview ・Easy to remove - Lighter, thinner and space-saving compared to conventional aluminum rings. ・Available in various sizes up to 12 inches

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    Grip ring used to maintain the expanded state of the wafer

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1 Models of Grip ring used to maintain the expanded state of the wafer

Product Image Part Number Price (excluding tax) Inner ring inner diameter/outer diameter (unit: mm) Outer ring inner diameter/outer diameter (unit: mm)
Grip ring used to maintain the expanded state of the wafer-Part Number-GRP-2620-33

GRP-2620-33

Available upon quote 121/127 115/121

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About Company Handling This Product

Hugle Electronics Co., Ltd.

  • Japan

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Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　Hugle Electronics Co., Ltd.
Hugle Electronics Co., Ltd.

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