Wafer expansion device with grip ring auto-clamp mechanism HS-1840-AC
Hugle Electronics Co., Ltd.
About This Product
This is a wafer expansion device equipped with a grip ring auto-clamp mechanism. The cutter mechanism built into the stage makes the tape skirt as short as possible, making subsequent handling easier. It can also be used for wafer and chip transfer applications.
■Product overview
・Grip ring, auto clamp mechanism
・Tape auto-cutting mechanism with built-in stage
・Touch panel control
・Film preheating mechanism (with timer)
・Stage heating (Max.100℃)
・Stage stroke adjustment mechanism (Max.80mm, 1mm range)
・Variable stage rise speed mechanism
・Maximum wafer size 8 inches
・Compatible with various expansion rings and frames
・Highly accurate stroke setting is possible by raising the stage by motor drive
・Can be used for wafer and chip transfer applications
・Touch panel operation
・Up to 4 recipes can be saved
・Safety measures Upper clamp fall prevention damper
・Safety measure Earth leakage breaker standard equipment
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Product
Wafer expansion device with grip ring auto-clamp mechanism HS-1840-AC
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Handling Company
Hugle Electronics Co., Ltd.
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Categories
1 Models of Wafer expansion device with grip ring auto-clamp mechanism HS-1840-AC
| Product Image | Part Number | Price (excluding tax) | Power supply | Size | Weight |
|---|---|---|---|---|---|
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HS-1840-AC |
Available upon quote | AC100V5A, 50/60Hz | 655 (D) × 386 (W) × 416 (H) mm | 35kg |
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