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  4. Wafer expansion device with grip ring auto-clamp mechanism HS-1840-AC (Hugle Electronics Co., Ltd.)
Wafer expansion device with grip ring auto-clamp mechanism HS-1840-AC-HS-1840-AC
Wafer expansion device with grip ring auto-clamp mechanism HS-1840-AC-Hugle Electronics Co., Ltd.

Wafer expansion device with grip ring auto-clamp mechanism HS-1840-AC
Hugle Electronics Co., Ltd.

About This Product

This is a wafer expansion device equipped with a grip ring auto-clamp mechanism. The cutter mechanism built into the stage makes the tape skirt as short as possible, making subsequent handling easier. It can also be used for wafer and chip transfer applications.

■Product overview

・Grip ring, auto clamp mechanism ・Tape auto-cutting mechanism with built-in stage ・Touch panel control ・Film preheating mechanism (with timer) ・Stage heating (Max.100℃) ・Stage stroke adjustment mechanism (Max.80mm, 1mm range) ・Variable stage rise speed mechanism ・Maximum wafer size 8 inches ・Compatible with various expansion rings and frames ・Highly accurate stroke setting is possible by raising the stage by motor drive ・Can be used for wafer and chip transfer applications ・Touch panel operation ・Up to 4 recipes can be saved ・Safety measures Upper clamp fall prevention damper ・Safety measure Earth leakage breaker standard equipment

  • Product

    Wafer expansion device with grip ring auto-clamp mechanism HS-1840-AC

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1 Models of Wafer expansion device with grip ring auto-clamp mechanism HS-1840-AC

Image Part Number Price (excluding tax) Power supply Weight Size
Wafer expansion device with grip ring auto-clamp mechanism HS-1840-AC-Part Number-HS-1840-AC

HS-1840-AC

Available upon quote

AC100V5A, 50/60Hz

35kg

655 (D) × 386 (W) × 416 (H) mm

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About Company Handling This Product

Hugle Electronics Co., Ltd.

  • Japan

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Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　Hugle Electronics Co., Ltd.
Hugle Electronics Co., Ltd.

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