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  2. Semiconductor Manufacturing
  3. Semiconductor Cleaning Equipment
  4. 12 inch compatible cleaning device FOUP/FOSB fully automatic cleaning system UPC-12500 (SORA) (Hugle Electronics Co., Ltd.)
12 inch compatible cleaning device FOUP/FOSB fully automatic cleaning system UPC-12500 (SORA)-UPC-12500
12 inch compatible cleaning device FOUP/FOSB fully automatic cleaning system UPC-12500 (SORA)-Hugle Electronics Co., Ltd.

12 inch compatible cleaning device FOUP/FOSB fully automatic cleaning system UPC-12500 (SORA)
Hugle Electronics Co., Ltd.

Hugle Electronics Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

51.6hours

About This Product

As an automatic cleaning device for FOUPs for 300mm wafers, this is a model change of the UPC-12100, which has earned the world's top-class performance and trust. It has been improved based on the concepts of high quality, high throughput, and energy savings that are essential for modern semiconductor manufacturing. Compliant with SEMI standards as well as CE standards.

■Product overview

・High throughput ・Footprint saving design ・Energy saving measures ・Prevention of cross contamination by fully automatic FOUP opening/closing ・Ultra-precision cleaning using two-fluid jet cleaning method ・High efficiency drying method ・Compatible with SEMI communication standard GEM300 ・High delivery record ・Compliant with SEMIS2, S8, CE standards

  • Product

    12 inch compatible cleaning device FOUP/FOSB fully automatic cleaning system UPC-12500 (SORA)

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1 Models of 12 inch compatible cleaning device FOUP/FOSB fully automatic cleaning system UPC-12500 (SORA)

Image Part Number Price (excluding tax) Device body
12 inch compatible cleaning device FOUP/FOSB fully automatic cleaning system UPC-12500 (SORA)-Part Number-UPC-12500

UPC-12500

Available upon quote

2,200 (W) ×3,250 (D) ×2,500 (H) mm (excluding protrusions)

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About Company Handling This Product

Hugle Electronics Co., Ltd.

Response Rate

100.0%

Response Time

51.6hrs

  • Japan

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Semiconductor Cleaning Equipment
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