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  4. Epoxy adhesive W ,Q ,U ,B bond (Nikka Seiko Co., Ltd.)
Epoxy adhesive W ,Q ,U ,B bond-W bond
Epoxy adhesive W ,Q ,U ,B bond-Nikka Seiko Co., Ltd.

Epoxy adhesive W ,Q ,U ,B bond
Nikka Seiko Co., Ltd.

Nikka Seiko Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

24.2hours

Relatively Fast Response

About This Product

A two-component epoxy adhesive developed for slicing monocrystalline/polycrystalline silicon, compounds, and oxide ingots. It cures at room temperature and has strong adhesive strength, and can be removed with warm water or a special release agent. A two-component epoxy adhesive developed for slicing semiconductor and solar cell ingots. It can be removed with warm water. We have a lineup that can meet a variety of needs, including quick-curing types and high-strength types, with mixing ratios of 1:1 and 2:1 for easy mixing.

  • Product

    Epoxy adhesive W ,Q ,U ,B bond

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Last viewed: 17 hours ago

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1 Models of Epoxy adhesive W ,Q ,U ,B bond

Image Part Number Price (excluding tax) Peeling warm water Peeling Heating Stripping Stripping solvent Main uses
Epoxy adhesive W ,Q ,U ,B bond-Part Number-W bond

W bond

Available upon quote

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Requires high hardness and high adhesive strength
For semiconductor ingot slicing

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About Company Handling This Product

Nikka Seiko Co., Ltd.

Response Rate

100.0%

Response Time

24.2hrs

  • Japan

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Glue
Glue　Nikka Seiko Co., Ltd.
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