Epoxy adhesive W ,Q ,U ,B bond
Nikka Seiko Co., Ltd.
About This Product
A two-component epoxy adhesive developed for slicing monocrystalline/polycrystalline silicon, compounds, and oxide ingots. It cures at room temperature and has strong adhesive strength, and can be removed with warm water or a special release agent.
A two-component epoxy adhesive developed for slicing semiconductor and solar cell ingots. It can be removed with warm water. We have a lineup that can meet a variety of needs, including quick-curing types and high-strength types, with mixing ratios of 1:1 and 2:1 for easy mixing.
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Product
Epoxy adhesive W ,Q ,U ,B bond
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Handling Company
Nikka Seiko Co., Ltd.
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Categories
1 Models of Epoxy adhesive W ,Q ,U ,B bond
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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W bond |
Available upon quote |
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About Company Handling This Product
- Japan