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History
Response Rate
100.0%
Response Time
77.6hours
Product
Seal-glo® Epoxy Heat Curing Adhesive One-Part Low Temperature Curing Epoxy AdhesiveHandling Company
FUJI CHEMICAL INDUSTRIAL CO., LTD.Categories
Image | Part Number | Price (excluding tax) | Viscosity (Pa・s) 25℃ | Purpose | Specific gravity | Recommended curing conditions | Exterior | Storage temperature | Thixotropic index | Shelf life |
---|---|---|---|---|---|---|---|---|---|---|
LTG830 |
Available upon quote |
3.8 |
For VCM actuators |
1.2 |
60℃/60min. |
Transparent |
-20℃ |
1 |
6 mths. |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.