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Seal-glo® Epoxy Heat Curing Adhesive One-Part Low Temperature Curing Epoxy Adhesive-LTG830
Seal-glo® Epoxy Heat Curing Adhesive One-Part Low Temperature Curing Epoxy Adhesive-FUJI CHEMICAL INDUSTRIAL CO., LTD.

Seal-glo® Epoxy Heat Curing Adhesive One-Part Low Temperature Curing Epoxy Adhesive
FUJI CHEMICAL INDUSTRIAL CO., LTD.

FUJI CHEMICAL INDUSTRIAL CO., LTD.'s Response Status

Response Rate

100.0%

Response Time

77.6hours


About This Product

A one-component heat-curing epoxy adhesive that meets the needs for low-temperature and short-time curing. Fixing LED backlight lenses and assembling VCM actuators, resins with heat resistance of 100℃ or less (ABS, acrylic, etc.) Ideal for adhesion. LTG800 is also suitable for resin-to-resin bonding, sealing, and glass bonding.

■60℃ hardening

Sufficient adhesive strength can be obtained even at temperatures as low as 60℃. It can be used not only for fixing LED lenses and VCM actuators, but also for adhesion and sealing on base materials with heat resistance problems.

■Brie dress

In customer evaluations, we confirmed that this product can suppress bleeding by more than 75% compared to conventional products.

■Characteristics

Cures at low temperatures and in a short time, and exhibits sufficient adhesion and heat resistance after curing. It can be applied to tall mountain shapes and has excellent application stability.

■Stable coating shape

Even with a dispenser, it maintains a stable application shape without dripping or stringiness.

■Cost reduction during production

Low-temperature curing reduces production costs during heating.

■No mixing or measuring required

There is no need to measure or mix base ingredients and curing agents, and you can always obtain stable quality.

  • Product

    Seal-glo® Epoxy Heat Curing Adhesive One-Part Low Temperature Curing Epoxy Adhesive

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1 Models of Seal-glo® Epoxy Heat Curing Adhesive One-Part Low Temperature Curing Epoxy Adhesive

Image Part Number Price (excluding tax) Viscosity (Pa・s) 25℃ Purpose Specific gravity Recommended curing conditions Exterior Storage temperature Thixotropic index Shelf life
Seal-glo® Epoxy Heat Curing Adhesive One-Part Low Temperature Curing Epoxy Adhesive-Part Number-LTG830

LTG830

Available upon quote

3.8

For VCM actuators

1.2

60℃/60min.

Transparent

-20℃

1

6 mths.

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About Company Handling This Product

Response Rate

100.0%


Response Time

77.6hrs

Company Overview

FUJI CHEMICAL INDUSTRIAL CO. Ltd., established in 1958 and based in Japan, is a manufacturer of thermosetting ...

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  • Japan

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