Seal-glo® Epoxy Heat Curing Adhesive One-Part Low Temperature Curing Epoxy Adhesive
FUJI CHEMICAL INDUSTRIAL CO., LTD.
About This Product
A one-component heat-curing epoxy adhesive that meets the needs for low-temperature and short-time curing. Fixing LED backlight lenses and assembling VCM actuators, resins with heat resistance of 100℃ or less (ABS, acrylic, etc.)
Ideal for adhesion. LTG800 is also suitable for resin-to-resin bonding, sealing, and glass bonding.
■60℃ hardening
Sufficient adhesive strength can be obtained even at temperatures as low as 60℃. It can be used not only for fixing LED lenses and VCM actuators, but also for adhesion and sealing on base materials with heat resistance problems.
■Brie dress
In customer evaluations, we confirmed that this product can suppress bleeding by more than 75% compared to conventional products.
■Characteristics
Cures at low temperatures and in a short time, and exhibits sufficient adhesion and heat resistance after curing. It can be applied to tall mountain shapes and has excellent application stability.
■Stable coating shape
Even with a dispenser, it maintains a stable application shape without dripping or stringiness.
■Cost reduction during production
Low-temperature curing reduces production costs during heating.
■No mixing or measuring required
There is no need to measure or mix base ingredients and curing agents, and you can always obtain stable quality.
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Product
Seal-glo® Epoxy Heat Curing Adhesive One-Part Low Temperature Curing Epoxy Adhesive
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Handling Company
FUJI CHEMICAL INDUSTRIAL CO., LTD.
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Categories
1 Models of Seal-glo® Epoxy Heat Curing Adhesive One-Part Low Temperature Curing Epoxy Adhesive
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
|
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LTG830 |
Available upon quote |
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