Seal-glo® Epoxy Thermosetting Adhesive Self-Aligning Adhesive NE9000H
FUJI CHEMICAL INDUSTRIAL CO., LTD.
About This Product
A one-component high-temperature curing epoxy adhesive for double-sided reflow that prevents parts from falling, shifting, and floating. It achieves high precision mounting without inhibiting the self-alignment phenomenon of cream solder.
■High precision mounting (±50μm)
This material can be used for high-precision mounting within ±50 µm, which is required with the increasing use of LED headlights in recent years, and prevents misalignment of LED chips.
■Reflow simultaneous curing
It is a material that hardens under SAC reflow conditions, and begins hardening at a temperature close to the solder melting temperature. Therefore, it does not interfere with the self-alignment properties of solder.
■Characteristics
It suppresses misalignment during double-sided reflow and exhibits high adhesive strength. It can be applied in a tall chevron shape and has excellent application stability.
■Improved mounting accuracy
Prevents parts from falling, shifting, and floating during double-sided reflow, allowing high-precision mounting.
■Stable coating shape
When applied with a dispenser, it maintains a tall mountain shape for good adhesion.
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Product
Seal-glo® Epoxy Thermosetting Adhesive Self-Aligning Adhesive NE9000H
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Handling Company
FUJI CHEMICAL INDUSTRIAL CO., LTD.
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Categories
1 Models of Seal-glo® Epoxy Thermosetting Adhesive Self-Aligning Adhesive NE9000H
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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NE9000H |
Available upon quote |
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