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Seal-glo® Epoxy Thermosetting Adhesive Self-Aligning Adhesive NE9000H-NE9000H
Seal-glo® Epoxy Thermosetting Adhesive Self-Aligning Adhesive NE9000H-FUJI CHEMICAL INDUSTRIAL CO., LTD.

Seal-glo® Epoxy Thermosetting Adhesive Self-Aligning Adhesive NE9000H
FUJI CHEMICAL INDUSTRIAL CO., LTD.

FUJI CHEMICAL INDUSTRIAL CO., LTD.'s Response Status

Response Rate

100.0%

Response Time

77.6hours


About This Product

A one-component high-temperature curing epoxy adhesive for double-sided reflow that prevents parts from falling, shifting, and floating. It achieves high precision mounting without inhibiting the self-alignment phenomenon of cream solder.

■High precision mounting (±50μm)

This material can be used for high-precision mounting within ±50 µm, which is required with the increasing use of LED headlights in recent years, and prevents misalignment of LED chips.

■Reflow simultaneous curing

It is a material that hardens under SAC reflow conditions, and begins hardening at a temperature close to the solder melting temperature. Therefore, it does not interfere with the self-alignment properties of solder.

■Characteristics

It suppresses misalignment during double-sided reflow and exhibits high adhesive strength. It can be applied in a tall chevron shape and has excellent application stability.

■Improved mounting accuracy

Prevents parts from falling, shifting, and floating during double-sided reflow, allowing high-precision mounting.

■Stable coating shape

When applied with a dispenser, it maintains a tall mountain shape for good adhesion.

  • Product

    Seal-glo® Epoxy Thermosetting Adhesive Self-Aligning Adhesive NE9000H

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1 Models of Seal-glo® Epoxy Thermosetting Adhesive Self-Aligning Adhesive NE9000H

Image Part Number Price (excluding tax) Viscosity (Pa・s) 25℃ Purpose Specific gravity Recommended curing conditions Exterior Storage temperature Thixotropic index Shelf life @2~10℃
Seal-glo® Epoxy Thermosetting Adhesive Self-Aligning Adhesive NE9000H-Part Number-NE9000H

NE9000H

Available upon quote

320Pa・s

Adhesive for reflow curing

1.23

SAC reflow conditions (220℃/30sec or more)

Red

2~10℃

7

9 mths.

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About Company Handling This Product

Response Rate

100.0%


Response Time

77.6hrs

Company Overview

FUJI CHEMICAL INDUSTRIAL CO. Ltd., established in 1958 and based in Japan, is a manufacturer of thermosetting ...

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  • Japan

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