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History
Response Rate
100.0%
Response Time
77.6hours
Product
Seal-glo® Epoxy thermosetting adhesive Adhesive for fixing chip componentsHandling Company
FUJI CHEMICAL INDUSTRIAL CO., LTD.Categories
Image | Part Number | Price (excluding tax) | Viscosity (Pa・s) 25℃ | Specific gravity | Recommended curing conditions | Dispensing application | Thixotropic index | Shelf life @2~10℃ | Glass transition point (℃) DSC |
---|---|---|---|---|---|---|---|---|---|
NE7300H |
Available upon quote |
320 |
1.35 |
100℃/60sec |
Fast dispenser |
7.1 |
8 mths. |
43 |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.