Seal-glo® Epoxy thermosetting adhesive Adhesive for fixing chip components
FUJI CHEMICAL INDUSTRIAL CO., LTD.
About This Product
A thermosetting adhesive for temporarily fixing chip components that exhibits excellent storage stability with just one liquid. High-speed curing is possible in 1 to 2 minutes at 90 to 150℃ heating required for SMD mounting. Suitable for fine dispensing whether high-speed dispenser or printing, series with various functions are also available.
■Fine application
This material has been widely used for 1005CR chips, and is also used for 0603CR chips, and is receiving increasing inquiries.
■Fast curing
All products can be cured within 60-90 seconds.
■Characteristics
It has excellent heat resistance and exhibits high adhesive strength in a variety of applications. The stable shape makes it easy to control the application area.
■High heat-resistant adhesion
It has excellent heat resistance and maintains high adhesion over a wide range of operating temperatures.
■Stable coating shape
The thixotropic property maintains the application shape with an appropriate peak height.
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Product
Seal-glo® Epoxy thermosetting adhesive Adhesive for fixing chip components
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Handling Company
FUJI CHEMICAL INDUSTRIAL CO., LTD.
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Categories
1 Models of Seal-glo® Epoxy thermosetting adhesive Adhesive for fixing chip components
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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NE7300H |
Available upon quote |
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