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Temperature slope inspection device flip chip mounter AFCM860-AFCM860
Temperature slope inspection device flip chip mounter AFCM860-AKIM Co., Ltd.

Temperature slope inspection device flip chip mounter AFCM860
AKIM Co., Ltd.

AKIM Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

64.9hours


About This Product

■Summary

This is a device that picks up IC chips from a wafer and mounts them on a TCXO package.

■Features

・The turret table provides low vibration, low dust generation, and high speed conveyance. ・Achieved a mounting takt of 0.6sec/chip by performing pickup and mounting at the same time.

  • Product

    Temperature slope inspection device flip chip mounter AFCM860

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1 Models of Temperature slope inspection device flip chip mounter AFCM860

Image Part Number Price (excluding tax) Target work External dimensions Chip supply Cycle time
Temperature slope inspection device flip chip mounter AFCM860-Part Number-AFCM860

AFCM860

Available upon quote

SMD type crystal oscillator, TCXO

W1,150×D1,050×H1,600mm (excluding monitor, indicator light, etc.)

Diced wafer

0.6 sec/piece

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About Company Handling This Product

Response Rate

100.0%


Response Time

64.9hrs

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