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Temperature slope inspection device Chip die bonder (high speed type) ASCD860T (tray type)-ASCD860T
Temperature slope inspection device Chip die bonder (high speed type) ASCD860T (tray type)-AKIM Co., Ltd.

Temperature slope inspection device Chip die bonder (high speed type) ASCD860T (tray type)
AKIM Co., Ltd.

AKIM Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

64.9hours


About This Product

■Summary

This is a device that applies adhesive to the sensor package and mounts the sensor chip with high precision.

■Features

・Turret table provides low vibration, low dust generation, and high speed conveyance. - Equipped with dispenser temperature control, needle height zero point detection, and application position feedback functions to stabilize application amount and improve application position accuracy. As an option, package height measurement and application height correction using a laser displacement meter is available. ・With a newly developed image recognition method and low vibration, we have achieved a mounting accuracy of ±0.015mm.

  • Product

    Temperature slope inspection device Chip die bonder (high speed type) ASCD860T (tray type)

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1 Models of Temperature slope inspection device Chip die bonder (high speed type) ASCD860T (tray type)

Image Part Number Price (excluding tax) External dimensions Work supply Chip supply Cycle time
Temperature slope inspection device Chip die bonder (high speed type) ASCD860T (tray type)-Part Number-ASCD860T

ASCD860T

Available upon quote

W1,700×D1,400×H1,700mm (excluding monitor, indicator light, etc.)

Tray supply (pieces)

Diced wafer

0.6 sec/piece

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About Company Handling This Product

Response Rate

100.0%


Response Time

64.9hrs

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