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History
Response Rate
100.0%
Response Time
64.9hours
Product
Temperature slope inspection device Chip die bonder (high speed type) ASCD860T (tray type)Handling Company
AKIM Co., Ltd.Categories
Image | Part Number | Price (excluding tax) | External dimensions | Work supply | Chip supply | Cycle time |
---|---|---|---|---|---|---|
ASCD860T |
Available upon quote |
W1,700×D1,400×H1,700mm (excluding monitor, indicator light, etc.) |
Tray supply (pieces) |
Diced wafer |
0.6 sec/piece |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.
Response Rate
100.0%
Response Time
64.9hrs