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History
Response Rate
100.0%
Response Time
64.9hours
Product
Temperature slope inspection device Chip die bonder ASCD750Handling Company
AKIM Co., Ltd.Categories
Image | Part Number | Price (excluding tax) | External dimensions | Work supply | Chip supply | Cycle time |
---|---|---|---|---|---|---|
ASCD750 |
Available upon quote |
W1,150×D1,250×H1,700mm (excluding monitor, indicator light, etc.) |
Tray supply (individual pieces), sheet substrate supply |
Diced wafer |
1.2 sec/piece |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.
Response Rate
100.0%
Response Time
64.9hrs