Metal–ceramic substrate-Cu-AlN Standard (AMB)

Metal–ceramic substrate
DOWA Metal Tech Co., Ltd.

About This Product

DOWA's metal-ceramic substrate lineup includes two types: copper-aluminum nitride and aluminum (aluminum-aluminum nitride), as well as an aluminum base integrated substrate (aluminum-aluminum nitride-aluminum base).

It is trusted as a substrate for power modules that require high heat resistance and high voltage resistance. It is one of the key parts essential to the configuration of inverter circuits for hybrid cars, Shinkansen trains, solar/wind power generation, co-generation systems, etc.

Model
There are 1 models for this product.

Product
Metal–ceramic substrate

Handling Company
DOWA Metal Tech Co., Ltd.

Categories

Boards & Circuit Boards

Metal Base Substrates

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1 Models of Metal–ceramic substrate

Image	Part Number	Price (excluding tax)	Metal thickness (circuit/heat sink) (mm)	Surface roughness (Rz) (μm)	Insulating strength (in insulating oil) (kV/mm)	White board strength (MPa)	Thermal conductivity (room temperature) (W/ (m・K) )	Minimum pattern spacing (mm)	Minimum pattern width (mm)	Flexural strength (MPa)	Warpage (mm)	Solder wettability (%)	Volume resistivity (room temperature) (Ω・cm)	Wire bonding strength (g)	Peel strength (N/cm)	Heat cycle property (-40℃/125℃)	Pattern dimension tolerance	Ceramic type	Ceramic maximum dimension (mm)	Ceramic thickness (mm)	Deflection amount (mm)	Ni plating thickness (μm)
	Cu-AlN Standard (AMB)	Available upon quote	0.15・0.2・0.25・0.3	<7	＞11	500	≧170	1	1	Initial: 500 370℃ After heat treatment: 400	≦0.1/50	≧95	＞1×10^12	＞550	＞150	＞200	≦±0.25	AlN	95×80	0.38・0.635・0.8・1.0	Initial: 0.27 After 370℃ heat treatment: 0.22	2~6